Abstract: A head-mounted display configured to be worn on a face includes a housing, a facial interface coupled to a rear portion of the housing and configured to engage with the face, a component chamber defined in the housing, and a fan located in the component chamber and configured to create air flow from the face through the facial interface and the component chamber.

Abstract: A head-mountable device can include a fan that effectively manages heat while also mitigating the intrusion of particles and other debris. Fans can include a protrusion that creates a tortuous pathway to direct incoming particles away from sensitive regions. Fans can include openings to allow particles to exit the fan enclosure and avoid interaction with the impeller. Fans can include a variable spacing between the impeller and the base plate to avoid collection of particles. Fans can include an adhesive pad that collects and retains particles at a location that does not interfere with rotation of the impeller.

Abstract: A portable electronic device may include a housing having a wall defining an opening in the housing and at least a portion of four side surfaces of the portable electronic device. The portable electronic device may further include a display at least partially within the housing, a front cover positioned in the opening in the housing and over the display, the front cover defining a front surface, a peripheral side surface extending from the front surface and at least partially surrounded by the wall of the housing, and a notch that, together with a portion of the wall of the housing, defines an acoustic port of the portable electronic device. The electronic device may further include an acoustic port cover positioned at least partially in the acoustic port and a speaker at least partially within the housing and configured to direct sound through the acoustic port cover.

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.

Abstract: This application relates to a portable electronic device. According to some embodiments, a portable electronic device is described. The portable electronic device includes a magnetically-responsive operational component capable of executing a function. The portable electronic device further includes an electronic component that generates magnetic flux, where the magnetic is capable of interfering with the execution of the function by the magnetically-responsive operational component. The portable electronic device further includes a shielding plate that includes (i) a first nickel-iron layer that overlays a first surface of the shielding plate, and (ii) a second nickel-iron layer that overlays a second surface of the shielding plate, where the second surface is opposite the first surface, and the first and second nickel-iron layers are capable of shielding the magnetic flux away from the magnetically-responsive operational component.

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.