Abstract: A wearable device is described. The wearable device can include a display screen and an outer housing. The outer housing can include a processor, a memory, and a transceiver. The outer housing can be attached to the display screen, and the outer housing can be mounted on an article of clothing. The processor is configured to receive via the transceiver a media from a smart device, and the processor is also configured to cause display of the media on the display screen.

Abstract: Trigger routing in computational hardware such as a digital-signal processor involves routing a trigger signal from a first, master module to a second, slave module, thereby initiating an event at the slave module without involving a core processing unit.

Abstract: Trigger routing in computational hardware such as a digital-signal processor involves routing a trigger signal from a first, master module to a second, slave module, thereby initiating an event at the slave module without involving a core processing unit.

Abstract: In one aspect, an integrated circuit (IC) system includes a receiver IC configured to receive a first clock signal and includes a feedback circuit configured to provide a feedback signal to a driver IC. The IC system also includes the driver IC configured to receive a second clock signal and includes a waveform generator configured to provide synthesized waveforms from DC to K-band, a serializer/deserializer (SERDES) to receive data from the waveform generator and to provide the signal to the receiver IC and a phase selection circuit to provide a phase selection signal to the first integrated circuit based on the feedback signal. The phase selection signal calibrates the signal from the SERDES and provides phase correction to the SERDES.

Abstract: In one aspect, an integrated circuit (IC) system includes a receiver IC configured to receive a first clock signal and includes a feedback circuit to provide a feedback signal to a driver IC. The system also includes the driver IC configured to receive a second clock signal and includes a phase selection circuit configured to provide a phase selection signal to the receiver IC based on the feedback signal. The phase selection signal controls the data received by the receiver IC by adjusting the first clock signal.

Abstract: An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semiconductor die (105) and housed inside the device package to decouple noise from input signals, and a heat spreader (195) disposed between a top surface of the semiconductor die (105) and a package cover (185). The semiconductor die (105) is configured as a flip chip die and the device package includes a package substrate (110) configured as a ball grid array. The improved microelectronic device (100) reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate (115) and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

Abstract: An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semiconductor die (105) and housed inside the device package to decouple noise from input signals, and a heat spreader (195) disposed between a top surface of the semiconductor die (105) and a package cover (185). The semiconductor die (105) is configured as a flip chip die and the device package includes a package substrate (110) configured as a ball grid array. The improved microelectronic device (100) reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate (115) and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

Abstract: In one aspect, an integrated circuit (IC) system includes a receiver IC configured to receive a first clock signal and includes a feedback circuit configured to provide a feedback signal to a driver IC. The IC system also includes the driver IC configured to receive a second clock signal and includes a waveform generator configured to provide synthesized waveforms from DC to K-band, a serializer/deserializer (SERDES) to receive data from the waveform generator and to provide the signal to the receiver IC and a phase selection circuit to provide a phase selection signal to the first integrated circuit based on the feedback signal. The phase selection signal calibrates the signal from the SERDES and provides phase correction to the SERDES.

Abstract: In one aspect, an integrated circuit (IC) system includes a receiver IC configured to receive a first clock signal and includes a feedback circuit to provide a feedback signal to a driver IC. The system also includes the driver IC configured to receive a second clock signal and includes a phase selection circuit configured to provide a phase selection signal to the receiver IC based on the feedback signal. The phase selection signal controls the data received by the receiver IC by adjusting the first clock signal.

Abstract: An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semiconductor die (105) and housed inside the device package to decouple noise from input signals, and a heat spreader (195) disposed between a top surface of the semiconductor die (105) and a package cover (185). The semiconductor die (105) is configured as a flip chip die and the device package includes a package substrate (110) configured as a ball grid array. The improved microelectronic device (100) reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate (115) and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

Abstract: An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semiconductor die (105) and housed inside the device package to decouple noise from input signals, and a heat spreader (195) disposed between a top surface of the semiconductor die (105) and a package cover (185). The semiconductor die (105) is configured as a flip chip die and the device package includes a package substrate (110) configured as a ball grid array. The improved microelectronic device (100) reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate (115) and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.