Patents by Inventor David J. Kim

David J. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240410182
    Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.
    Type: Application
    Filed: August 16, 2024
    Publication date: December 12, 2024
    Applicants: EcoInteriors Corp., OneFlor USA, LLC
    Inventors: David J. Kim, Chi-Jung Lin
  • Patent number: 12098558
    Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: September 24, 2024
    Assignees: EcoInteriors Corp., OneFlor USA, LLC
    Inventors: David J. Kim, Chi-Jung Lin
  • Patent number: 12097140
    Abstract: An absorbent article can have a topsheet layer, a liquid impermeable layer, and an absorbent core positioned between the topsheet layer and the liquid impermeable layer. The absorbent article can further include an exudate management layer in fluid communication with the topsheet layer. In various embodiments, the exudate management layer can be positioned on a body facing surface of the topsheet layer. In various embodiments, the exudate management layer can be positioned between the topsheet layer and the absorbent core. The exudate management layer has a first component which defines an opening for direct passage of body exudates into the absorbent core. The exudate management layer has a second component which at least partially overlaps the first component of the exudate management layer and further extends in the longitudinal direction of the absorbent article in a direction towards the posterior region of the absorbent article.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 24, 2024
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Matthew D. Woods, David J. Nickel, Jason G. Csida, Palani Raj R. Wallajapet, Hwa Y. Kim
  • Patent number: 11565080
    Abstract: Disclosed herein is a catheter tip sized and configured to fit onto a distal end of a catheter shaft, the catheter shaft having a shaft outer diameter. The catheter tip includes a base, a tip having an arcuate shape, an outer surface extending from the base to the tip along a longitudinal axis, the outer surface having a diameter at the base that is substantially equal to the shaft outer diameter, and an inner surface extending from the base, wherein the inner surface defines a first region having a first diameter and a second region having a second diameter, wherein the second diameter is less than the first diameter, and wherein the second region is distal of the first region and configured to receive at least one component extending beyond the distal end of the catheter shaft.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: January 31, 2023
    Assignee: St. Jude Medical, Cardiology Division, Inc.
    Inventors: Varun Bansal, Jodee M. Wakefield, Brent Ford, Ryan D. Hendrickson, David J. Kim, Zachary L. Helgeson
  • Publication number: 20220259868
    Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).
    Type: Application
    Filed: February 28, 2022
    Publication date: August 18, 2022
    Applicants: EcoInteriors Corp., OneFlor USA, LLC
    Inventors: David J. Kim, Chi-Jung Lin
  • Publication number: 20200378133
    Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).
    Type: Application
    Filed: February 11, 2020
    Publication date: December 3, 2020
    Applicant: EcoInteriors Corp.
    Inventors: David J. Kim, Chi-Jung Lin
  • Patent number: 10816371
    Abstract: Embodiments of the present disclosure relate generally to a liquid level sensor system that allows ease of connection and disconnection of a removable vessel (such as a toilet bowl) from a stationary unit (such as a toilet frame). The system provides at least one liquid level sensor (a first part of the sensor probe connection) mounted to the removable vessel, a liquid level sensor circuit board mounted to the unit, and a connection feature (a second part of a sensor probe connection) configured to extend between the sensor and the circuit board. When the removable vessel is removed from the vessel, the sensor probe connection is disconnected without the need for manual intervention. Installation of multiple probes and varying their location can support detection of a single or several discrete levels, or provide for any required redundancy of detection.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 27, 2020
    Assignee: MAG Aerospace Industries, LLC
    Inventors: Robert G. Ratliff, Oscar Mathews, David A. Beach, Christopher Jin Sung Choi, David J. Kim, Razmik B. Boodaghians
  • Patent number: 10753100
    Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: August 25, 2020
    Assignee: Ecointeriors Corp.
    Inventors: David J. Kim, Chi-Jung Lin
  • Publication number: 20190048593
    Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.
    Type: Application
    Filed: March 22, 2018
    Publication date: February 14, 2019
    Inventors: David J. Kim, Chi-Jung Lin
  • Publication number: 20180313675
    Abstract: Embodiments of the present disclosure relate generally to a liquid level sensor system that allows ease of connection and disconnection of a removable vessel (such as a toilet bowl) from a stationary unit (such as a toilet frame). The system provides at least one liquid level sensor (a first part of the sensor probe connection) mounted to the removable vessel, a liquid level sensor circuit board mounted to the unit, and a connection feature (a second part of a sensor probe connection) configured to extend between the sensor and the circuit board. When the removable vessel is removed from the vessel, the sensor probe connection is disconnected without the need for manual intervention. Installation of multiple probes and varying their location can support detection of a single or several discrete levels, or provide for any required redundancy of detection.
    Type: Application
    Filed: April 26, 2018
    Publication date: November 1, 2018
    Applicant: MAG Aerospace Industries, LLC
    Inventors: Robert G. Ratliff, Oscar Mathews, David A. Beach, Christopher Jin Sung Choi, David J. Kim, Razmik B. Boodaghians
  • Patent number: 6836412
    Abstract: An enclosure includes a base having an interior volume and a first cover attachable to the base and adapted to cover a first portion of the interior volume of the base such that, with the first cover attached to the base, a second portion of the interior volume of the base is accessible. The enclosure further includes a second cover attachable to the base and adapted to cover a second portion of the interior volume of the base, wherein the first cover in combination with the second cover covers generally all of the interior volume of the base.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: December 28, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: David J. Kim, Dimitry Struve, William W. Ruckman
  • Patent number: 6727717
    Abstract: An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: April 27, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: David J. Kim, Anthony Kozaczuk, Wenjun Bill Chen
  • Patent number: 6661656
    Abstract: An enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion the base. A computer system includes a motherboard having a central processing unit, a power supply capable of supplying power to the motherboard, and an enclosure capable of housing the motherboard and the power supply. The enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion of the base.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: December 9, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: David J. Kim, William W. Ruckman, Anthony Kozaczuk
  • Publication number: 20030057983
    Abstract: An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.
    Type: Application
    Filed: September 27, 2001
    Publication date: March 27, 2003
    Inventors: David J. Kim, Anthony Kozaczuk, Wenjun Bill Chen
  • Publication number: 20030049948
    Abstract: A computer assembly includes a motherboard having a first bus extending to a first connector and a riser card having a second bus extending to a plurality of connectors and extending to a second connector adapted to mate with the first contact set of the motherboard to couple the first bus with the second bus. The computer assembly further includes a first expansion card having a third bus extending to a third connector adapted to mate with one of the plurality of connectors of the riser card to couple the third bus with the second bus. A method includes driving a first signal onto a motherboard bus, transmitting the first signal over the motherboard bus to a riser card bus, and transmitting the first signal over the riser card bus to a plurality of expansion card buses.
    Type: Application
    Filed: September 13, 2001
    Publication date: March 13, 2003
    Inventors: David J. Kim, Dimitry Struve, William W. Ruckman, Anthony Kozaczuk
  • Publication number: 20030047606
    Abstract: A smart card reader assembly includes a printed circuit board having a bus, a smart card reader interconnected with the bus of the printed circuit board, and a connector interconnected with the bus of the printed circuit board. The smart card reader is capable of reading data from a smart card and is capable of transmitting signals representing the data to the bus of the printed circuit board. Further, the smart card reader assembly is capable of being oriented so that the smart card may be inserted into the smart card reader in an upright orientation.
    Type: Application
    Filed: September 13, 2001
    Publication date: March 13, 2003
    Inventors: David J. Kim, Dimitry Struve, William W. Ruckman
  • Publication number: 20030048606
    Abstract: An enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion the base. A computer system includes a motherboard having a central processing unit, a power supply capable of supplying power to the motherboard, and an enclosure capable of housing the motherboard and the power supply. The enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion of the base.
    Type: Application
    Filed: September 13, 2001
    Publication date: March 13, 2003
    Inventors: David J. Kim, William W. Ruckman, Anthony Kozaczuk
  • Publication number: 20030048622
    Abstract: An enclosure includes a base having an interior volume and a first cover attachable to the base and adapted to cover a first portion of the interior volume of the base such that, with the first cover attached to the base, a second portion of the interior volume of the base is accessible. The enclosure further includes a second cover attachable to the base and adapted to cover a second portion of the interior volume of the base, wherein the first cover in combination with the second cover covers generally all of the interior volume of the base.
    Type: Application
    Filed: September 13, 2001
    Publication date: March 13, 2003
    Inventors: David J. Kim, Dimitry Struve, William W. Ruckman
  • Patent number: 6519140
    Abstract: A bezel assembly for a computer enclosure includes a bezel and a hinge capable of hingedly joining the bezel to the computer enclosure. A computer system includes an enclosure, a bezel, and a hinge capable of hingedly joining the bezel to the enclosure. A method of replacing a first component with a second component in a computer system enclosure having a hinged bezel includes pivoting the hinged bezel away from the computer system enclosure and removing the first component from the computer system enclosure. The method further includes inserting the second component into the computer system enclosure and pivoting the hinged bezel toward the computer system such that the hinged bezel is adjacent the computer system enclosure.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: February 11, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: David J. Kim, William W. Ruckman, Milton C. Lee, Dimitry Struve
  • Patent number: 6392149
    Abstract: A cable arm for a computer system includes a first leg, a second leg hingedly joined to the first leg, and an enclosure flange hingedly joined to the second leg. The cable arm further includes a rack flange, hingedly joined to the first leg, capable of being attached to a rack for holding the computer system, an enclosure bracket capable of being attached to the computer system and capable of being attached to the enclosure flange, and a hook, extending from the second leg, capable retaining a cable attached to the computer system.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: May 21, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: David J. Kim, William W. Ruckman, Steven J. Furuta