Patents by Inventor David J. Kim
David J. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240410182Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.Type: ApplicationFiled: August 16, 2024Publication date: December 12, 2024Applicants: EcoInteriors Corp., OneFlor USA, LLCInventors: David J. Kim, Chi-Jung Lin
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Patent number: 12098558Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).Type: GrantFiled: February 28, 2022Date of Patent: September 24, 2024Assignees: EcoInteriors Corp., OneFlor USA, LLCInventors: David J. Kim, Chi-Jung Lin
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Patent number: 12097140Abstract: An absorbent article can have a topsheet layer, a liquid impermeable layer, and an absorbent core positioned between the topsheet layer and the liquid impermeable layer. The absorbent article can further include an exudate management layer in fluid communication with the topsheet layer. In various embodiments, the exudate management layer can be positioned on a body facing surface of the topsheet layer. In various embodiments, the exudate management layer can be positioned between the topsheet layer and the absorbent core. The exudate management layer has a first component which defines an opening for direct passage of body exudates into the absorbent core. The exudate management layer has a second component which at least partially overlaps the first component of the exudate management layer and further extends in the longitudinal direction of the absorbent article in a direction towards the posterior region of the absorbent article.Type: GrantFiled: March 29, 2018Date of Patent: September 24, 2024Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Matthew D. Woods, David J. Nickel, Jason G. Csida, Palani Raj R. Wallajapet, Hwa Y. Kim
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Patent number: 11565080Abstract: Disclosed herein is a catheter tip sized and configured to fit onto a distal end of a catheter shaft, the catheter shaft having a shaft outer diameter. The catheter tip includes a base, a tip having an arcuate shape, an outer surface extending from the base to the tip along a longitudinal axis, the outer surface having a diameter at the base that is substantially equal to the shaft outer diameter, and an inner surface extending from the base, wherein the inner surface defines a first region having a first diameter and a second region having a second diameter, wherein the second diameter is less than the first diameter, and wherein the second region is distal of the first region and configured to receive at least one component extending beyond the distal end of the catheter shaft.Type: GrantFiled: February 5, 2020Date of Patent: January 31, 2023Assignee: St. Jude Medical, Cardiology Division, Inc.Inventors: Varun Bansal, Jodee M. Wakefield, Brent Ford, Ryan D. Hendrickson, David J. Kim, Zachary L. Helgeson
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Publication number: 20220259868Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).Type: ApplicationFiled: February 28, 2022Publication date: August 18, 2022Applicants: EcoInteriors Corp., OneFlor USA, LLCInventors: David J. Kim, Chi-Jung Lin
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Publication number: 20200378133Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).Type: ApplicationFiled: February 11, 2020Publication date: December 3, 2020Applicant: EcoInteriors Corp.Inventors: David J. Kim, Chi-Jung Lin
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Patent number: 10816371Abstract: Embodiments of the present disclosure relate generally to a liquid level sensor system that allows ease of connection and disconnection of a removable vessel (such as a toilet bowl) from a stationary unit (such as a toilet frame). The system provides at least one liquid level sensor (a first part of the sensor probe connection) mounted to the removable vessel, a liquid level sensor circuit board mounted to the unit, and a connection feature (a second part of a sensor probe connection) configured to extend between the sensor and the circuit board. When the removable vessel is removed from the vessel, the sensor probe connection is disconnected without the need for manual intervention. Installation of multiple probes and varying their location can support detection of a single or several discrete levels, or provide for any required redundancy of detection.Type: GrantFiled: April 26, 2018Date of Patent: October 27, 2020Assignee: MAG Aerospace Industries, LLCInventors: Robert G. Ratliff, Oscar Mathews, David A. Beach, Christopher Jin Sung Choi, David J. Kim, Razmik B. Boodaghians
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Patent number: 10753100Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.Type: GrantFiled: March 22, 2018Date of Patent: August 25, 2020Assignee: Ecointeriors Corp.Inventors: David J. Kim, Chi-Jung Lin
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Publication number: 20190048593Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.Type: ApplicationFiled: March 22, 2018Publication date: February 14, 2019Inventors: David J. Kim, Chi-Jung Lin
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Publication number: 20180313675Abstract: Embodiments of the present disclosure relate generally to a liquid level sensor system that allows ease of connection and disconnection of a removable vessel (such as a toilet bowl) from a stationary unit (such as a toilet frame). The system provides at least one liquid level sensor (a first part of the sensor probe connection) mounted to the removable vessel, a liquid level sensor circuit board mounted to the unit, and a connection feature (a second part of a sensor probe connection) configured to extend between the sensor and the circuit board. When the removable vessel is removed from the vessel, the sensor probe connection is disconnected without the need for manual intervention. Installation of multiple probes and varying their location can support detection of a single or several discrete levels, or provide for any required redundancy of detection.Type: ApplicationFiled: April 26, 2018Publication date: November 1, 2018Applicant: MAG Aerospace Industries, LLCInventors: Robert G. Ratliff, Oscar Mathews, David A. Beach, Christopher Jin Sung Choi, David J. Kim, Razmik B. Boodaghians
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Patent number: 6836412Abstract: An enclosure includes a base having an interior volume and a first cover attachable to the base and adapted to cover a first portion of the interior volume of the base such that, with the first cover attached to the base, a second portion of the interior volume of the base is accessible. The enclosure further includes a second cover attachable to the base and adapted to cover a second portion of the interior volume of the base, wherein the first cover in combination with the second cover covers generally all of the interior volume of the base.Type: GrantFiled: September 13, 2001Date of Patent: December 28, 2004Assignee: Sun Microsystems, Inc.Inventors: David J. Kim, Dimitry Struve, William W. Ruckman
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Patent number: 6727717Abstract: An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.Type: GrantFiled: September 27, 2001Date of Patent: April 27, 2004Assignee: Sun Microsystems, Inc.Inventors: David J. Kim, Anthony Kozaczuk, Wenjun Bill Chen
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Patent number: 6661656Abstract: An enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion the base. A computer system includes a motherboard having a central processing unit, a power supply capable of supplying power to the motherboard, and an enclosure capable of housing the motherboard and the power supply. The enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion of the base.Type: GrantFiled: September 13, 2001Date of Patent: December 9, 2003Assignee: Sun Microsystems, Inc.Inventors: David J. Kim, William W. Ruckman, Anthony Kozaczuk
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Publication number: 20030057983Abstract: An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.Type: ApplicationFiled: September 27, 2001Publication date: March 27, 2003Inventors: David J. Kim, Anthony Kozaczuk, Wenjun Bill Chen
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Publication number: 20030049948Abstract: A computer assembly includes a motherboard having a first bus extending to a first connector and a riser card having a second bus extending to a plurality of connectors and extending to a second connector adapted to mate with the first contact set of the motherboard to couple the first bus with the second bus. The computer assembly further includes a first expansion card having a third bus extending to a third connector adapted to mate with one of the plurality of connectors of the riser card to couple the third bus with the second bus. A method includes driving a first signal onto a motherboard bus, transmitting the first signal over the motherboard bus to a riser card bus, and transmitting the first signal over the riser card bus to a plurality of expansion card buses.Type: ApplicationFiled: September 13, 2001Publication date: March 13, 2003Inventors: David J. Kim, Dimitry Struve, William W. Ruckman, Anthony Kozaczuk
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Publication number: 20030047606Abstract: A smart card reader assembly includes a printed circuit board having a bus, a smart card reader interconnected with the bus of the printed circuit board, and a connector interconnected with the bus of the printed circuit board. The smart card reader is capable of reading data from a smart card and is capable of transmitting signals representing the data to the bus of the printed circuit board. Further, the smart card reader assembly is capable of being oriented so that the smart card may be inserted into the smart card reader in an upright orientation.Type: ApplicationFiled: September 13, 2001Publication date: March 13, 2003Inventors: David J. Kim, Dimitry Struve, William W. Ruckman
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Publication number: 20030048606Abstract: An enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion the base. A computer system includes a motherboard having a central processing unit, a power supply capable of supplying power to the motherboard, and an enclosure capable of housing the motherboard and the power supply. The enclosure includes a base having an interior portion defined by a first side panel and a second side panel and a frame joined to the first side panel and the second side panel such that the frame extends across the interior portion of the base.Type: ApplicationFiled: September 13, 2001Publication date: March 13, 2003Inventors: David J. Kim, William W. Ruckman, Anthony Kozaczuk
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Publication number: 20030048622Abstract: An enclosure includes a base having an interior volume and a first cover attachable to the base and adapted to cover a first portion of the interior volume of the base such that, with the first cover attached to the base, a second portion of the interior volume of the base is accessible. The enclosure further includes a second cover attachable to the base and adapted to cover a second portion of the interior volume of the base, wherein the first cover in combination with the second cover covers generally all of the interior volume of the base.Type: ApplicationFiled: September 13, 2001Publication date: March 13, 2003Inventors: David J. Kim, Dimitry Struve, William W. Ruckman
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Patent number: 6519140Abstract: A bezel assembly for a computer enclosure includes a bezel and a hinge capable of hingedly joining the bezel to the computer enclosure. A computer system includes an enclosure, a bezel, and a hinge capable of hingedly joining the bezel to the enclosure. A method of replacing a first component with a second component in a computer system enclosure having a hinged bezel includes pivoting the hinged bezel away from the computer system enclosure and removing the first component from the computer system enclosure. The method further includes inserting the second component into the computer system enclosure and pivoting the hinged bezel toward the computer system such that the hinged bezel is adjacent the computer system enclosure.Type: GrantFiled: September 13, 2001Date of Patent: February 11, 2003Assignee: Sun Microsystems, Inc.Inventors: David J. Kim, William W. Ruckman, Milton C. Lee, Dimitry Struve
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Patent number: 6392149Abstract: A cable arm for a computer system includes a first leg, a second leg hingedly joined to the first leg, and an enclosure flange hingedly joined to the second leg. The cable arm further includes a rack flange, hingedly joined to the first leg, capable of being attached to a rack for holding the computer system, an enclosure bracket capable of being attached to the computer system and capable of being attached to the enclosure flange, and a hook, extending from the second leg, capable retaining a cable attached to the computer system.Type: GrantFiled: September 13, 2001Date of Patent: May 21, 2002Assignee: Sun Microsystems, Inc.Inventors: David J. Kim, William W. Ruckman, Steven J. Furuta