Abstract: Devices and techniques for placing and bonding identical elements to holes in a substrate where spacer balls and a reference surface are used to achieve the desired accuracy.

Abstract: Devices and techniques for placing and bonding identical elements to holes in a substrate where spacer balls and a reference surface are used to achieve the desired accuracy.

Abstract: The invention provides a new method and apparatus for electrically accessing a lapping sensor positioned along a row of slider sites on a wafer. The apparatus for accessing the lapping sensor may be positioned outside of the boundaries of the slider sites. The apparatus may also provide top conductors electrically connecting target pads to contact pads. The process for lapping rows of slider sites includes coupling a measurement device to a target pad, coupling a lapping sensor to the top conductor, and lapping the row until the measurement device detects a predetermined signal from the lapping sensor.

Abstract: The invention provides a new method and apparatus for creating smooth and uniform air-bearing surfaces on disk sliders. A lapping fixture includes a compliant pad which allows substantially uniform pressure to be applied between the slider and a lapping surface. Multiple sliders may be lapped simultaneously, with the compliant pad allowing each slider to float substantially independently of the other sliders against the lapping surface. Positioning surfaces are provided on the lapping fixture to position the sliders relative to the lapping surface and to allow a predetermined force to be applied to each slider independent of the force of the lapping fixture against the lapping surface.