Abstract: An audio session management method may involve: determining, by an audio session manager, one or more first media engine capabilities of a first media engine of a first smart audio device, the first media engine being configured for managing one or more audio media streams received by the first smart audio device and for performing first smart audio device signal processing for the one or more audio media streams according to a first media engine sample clock; receiving, by the audio session manager and via a first application communication link, first application control signals from the first application; and controlling the first smart audio device according to the first media engine capabilities, by the audio session manager, via first audio session management control signals transmitted to the first smart audio device via a first smart audio device communication link and without reference to the first media engine sample clock.

Abstract: An audio session management method may involve: determining, by an audio session manager, one or more first media engine capabilities of a first media engine of a first smart audio device, the first media engine being configured for managing one or more audio media streams received by the first smart audio device and for performing first smart audio device signal processing for the one or more audio media streams according to a first media engine sample clock; receiving, by the audio session manager and via a first application communication link, first application control signals from the first application; and controlling the first smart audio device according to the first media engine capabilities, by the audio session manager, via first audio session management control signals transmitted to the first smart audio device via a first smart audio device communication link and without reference to the first media engine sample clock.

Abstract: Printed circuit boards having a plurality of circuit layers are produced using a specific processing sequence. A copper-clad substrate is first patterned in a desired configuration to produce the first layer of the printed circuit board. The patterned metallization is then covered with a specifically formalated energy sensitive material. The energy sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern. The entire substrate is blanket-cured to produce a rigid layer having openings in appropriate places. The openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

Abstract: Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the fingers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.