Abstract: Fan trays and components thereof are described herein. In some embodiments, a removable, compact fan tray is configured to be disposed within a slot of a chassis. The fan tray can be latchably coupled to the chassis, and/or can include a light source, such as an LED operable to depict the status of the fan tray. Leads of the light source can be disposed within an sleeve operable to contain and/or insulate the leads. The fan tray can, in some embodiments, be configured to be keyed to a particular type of chassis slot, for example, a slot associated with an air flow direction.

Abstract: Fan trays and components thereof are described herein. In some embodiments, a removable, compact fan tray is configured to be disposed within a slot of a chassis. The fan tray can be latchably coupled to the chassis, and/or can include a light source, such as an LED operable to depict the status of the fan tray. Leads of the light source can be disposed within an sleeve operable to contain and/or insulate the leads. The fan tray can, in some embodiments, be configured to be keyed to a particular type of chassis slot, for example, a slot associated with an air flow direction.

Abstract: Fan trays and components thereof are described herein. In some embodiments, a removable, compact fan tray is configured to be disposed within a slot of a chassis. The fan tray can be latchably coupled to the chassis, and/or can include a light source, such as an LED operable to depict the status of the fan tray. Leads of the light source can be disposed within an sleeve operable to contain and/or insulate the leads. The fan tray can, in some embodiments, be configured to be keyed to a particular type of chassis slot, for example, a slot associated with an air flow direction.

Abstract: In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive.

Abstract: An apparatus for clamping and relieving strain in a set of optical fiber ribbon. The strain relief clamp includes a first attachment portion and second attachment portion configured to secure the strain relief clamp to a system component and a set of optical fiber ribbons to the strain relief clamp. When secured the strain relief clamp is configured to relieve strain in the set of optical fiber ribbons.

Abstract: A re-workable heat dissipation assembly may include a non-removable adhesive layer. A first interposer layer may be adhered to a device via the non-removable adhesive layer. A removable adhesive layer may be adhered to the first interposer layer. A heat dissipation assembly may be adhered to the removable adhesive layer. Use of an interposer layer and a removable adhesive layer in combination with a non-removable adhesive layer, provides a high performance heat dissipation assembly while enabling re-working of the assembly following initial manufacture.

Abstract: Fan tray assemblies for cooling electronic devices in data processing units are described herein. In some embodiments, an apparatus includes a fan tray and a stator member. The fan tray is configured to be mounted within a data processing unit, and defines an opening. The fan tray is configured to be coupled to a fan such that the fan and the opening collectively define a portion of an air flow path. The stator member includes multiple stator blades. The stator member is separate from the fan and configured to be coupled to the fan tray such that the stator blades are within the air flow path.

Abstract: Printed circuit boards and assemblies for cooling electronic devices in processing units are described herein. In some embodiments, a printed circuit board configured to be coupled to an electronic device defines a first set of lumens configured to receive a mounting portion of a frame. The frame and a portion of a first surface of the printed circuit board collectively define an internal volume within which at least a portion of the electronic device can be disposed and an external volume that is external to the internal volume. The printed circuit board defines a second set of lumens positioned to place at least a portion of the external volume in fluid communication with the internal volume.

Abstract: Heat sinks having a thermal interface for cooling electronic devices processing units are described herein. In some embodiments, a thermal interface member includes a first material defining a first layer of the apparatus. The thermal interface member further includes a second material being deformable and thermally conductive, and a third material different from the second material, that is an adhesive material. The second material and the third material collectively define a second layer of the apparatus having a first region and a second region. The first region is formed from the second material. The second region is formed from the third material.

Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.

Abstract: An electronic device includes a bay for a removable component with a vertical axis of insertion and removal. The component is inserted upwardly in the electronic device with aid of an actuation mechanism. For example, the actuation mechanism may include a lever and a horizontal support member sized to hold the bottom side of the component. Rotation of the lever translates the support member in the vertical direction to smoothly lift the component into a seated position in which connectors in the component and the electronic device are coupled. The actuation mechanism may include a latch to hold the component securely in the seated position. Rotation of the lever in the opposite direction lowers the support member. The actuation mechanism may include one or more tabs on the horizontal support member or elsewhere that pull the component during removal to overcome the unmating force of the connectors.

Abstract: Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.

Abstract: In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive.

Abstract: Air flow ducts for improving the air flow within data processing units are described herein. In some embodiments, a duct includes an inlet portion and an outlet portion. An interior surface of the outlet portion of the duct defines, at least in part, a portion of a flow path. The duct is configured to be coupled to a printed circuit board within a data processing unit such that a first portion of a cooling fluid can flow within the flow path between the inlet portion of the duct and an electronic device coupled to the printed circuit board. An exterior surface of the outlet portion of the duct is configured to redirect a second portion of the cooling fluid to a volume within the data processing unit apart from the electronic device.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.

Abstract: In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive.

Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

Abstract: Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.