Abstract: A method for seismic surveying comprises deploying a plurality of seismic receivers proximate an area of subsurface to be surveyed. At least one seismic energy source moves in a path that circumscribes a center, wherein positions of the plurality of seismic receivers remain fixed. At least one of a distance between the path and the center changes monotonically as seismic energy source traverses the path, or the center moves in a selected direction as the seismic energy source traverses the path. The source is actuated at selected times as the at least one seismic energy source traverses the path, such that a spacing between positions of the source along the source path and transverse to the source path varies between successive actuations of the source. Seismic energy is detected at the plurality of seismic receivers resulting from actuating the at least one seismic energy source.

Abstract: A method for seismic surveying comprises deploying a plurality of seismic receivers proximate an area of subsurface to be surveyed. At least one seismic energy source moves in a path that circumscribes a center, wherein positions of the plurality of seismic receivers remain fixed. At least one of a distance between the path and the center changes monotonically as seismic energy source traverses the path, or the center moves in a selected direction as the seismic energy source traverses the path. The source is actuated at selected times as the at least one seismic energy source traverses the path, such that a spacing between positions of the source along the source path and transverse to the source path varies between successive actuations of the source. Seismic energy is detected at the plurality of seismic receivers resulting from actuating the at least one seismic energy source.

Abstract: In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer and a first sensor that is positioned on a first side of the substrate layer, bonding a cap structure over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.

Abstract: In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer and a first sensor that is positioned on a first side of the substrate layer, bonding a cap structure over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.

Abstract: In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer and a first sensor that is positioned on a first side of the substrate layer, bonding a cap structure over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.

Abstract: A system for programming integrated circuit (IC) dies formed on a wafer includes an optical transmitter that outputs a digital test program as an optical signal. At least one optical sensor (e.g., photodiode) is formed with the IC dies on the wafer. The optical sensor detects and receives the optical signal. A processor formed on the wafer converts the optical signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The optical transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the optical signal so that all of the IC dies are concurrently programmed with the digital test program.

Abstract: In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer and a first sensor that is positioned on a first side of the substrate layer, bonding a cap structure over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.

Abstract: A system for programming magnetic field sensors formed on a wafer includes a magnetic field transmitter that outputs a digital test program as a magnetic signal. At least one digital magnetic sensor (e.g., magnetoresistive sensor) is formed with the magnetic field sensors on the wafer and is distinct from the magnetic field sensors. The digital magnetic sensor detects and receives the magnetic signal. A processor formed on the wafer converts the magnetic signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the magnetic field sensors. The magnetic field transmitter does not physically contact the wafer, but can flood an entire surface of the wafer with the magnetic signal so that all of the magnetic field sensors are concurrently programmed with the digital test program.

Abstract: A system for programming integrated circuit (IC) dies formed on a wafer includes an optical transmitter that outputs a digital test program as an optical signal. At least one optical sensor (e.g., photodiode) is formed with the IC dies on the wafer. The optical sensor detects and receives the optical signal. A processor formed on the wafer converts the optical signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The optical transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the optical signal so that all of the IC dies are concurrently programmed with the digital test program.

Abstract: A sensor device includes sensors that sense different physical stimuli. Fabrication of the device entails forming a device structure having a first and second wafer layers with a signal routing layer interposed between them. Active transducer elements of one or more sensors are formed in the second wafer layer. A third wafer layer is attached with the second wafer layer to produce one or more cavities in which the active transducer elements are located. Ports may be formed in the third wafer layer to adjust the pressure within the cavities during manufacture. The third wafer layer includes either a reference element or diaphragm of a pressure sensor. A fourth wafer layer may be coupled to the third wafer layer. The third and fourth wafer layers can include active and non-active circuitry such as integrated circuits, sensor components, microcontrollers, and the like.

Abstract: A method for acquiring marine seismic data includes towing a seismic energy source in a body of water and towing a seismic sensor at a selected distance from the seismic energy source. The seismic energy source is actuated a plurality of positions, a distance between each of the plurality of actuations being randomly different than any other such distance. Seismic energy detected by the seismic sensor is substantially continuously recorded through a plurality of actuations of the at least one seismic energy source. The recording includes recording a geodetic position of the at least one seismic energy source and the at least one seismic sensor at each actuation.

Abstract: A device (20) includes sensors (30, 32, 34) that sense different physical stimuli. Fabrication (90) entails forming (92) a device structure (22) to include the sensors and coupling (150) a cap structure (24) with the device structure so that the sensors are interposed between the cap structure and a substrate layer (28) of the device structure. Fabrication (90) further entails forming ports (38, 40) in the substrate layer (28) such that one port (38) exposes a sense element (44) of the sensor (30) to an external environment (72), and another port (40) temporarily exposes the sensor (34) to the external environment. A seal structure (26) is attached to the substrate layer (28) such that one port (40) is hermetically sealed by the seal structure and an external port (46) of the seal structure is aligned with the port (38).

Abstract: A wave glider system includes a float having geodetic navigation equipment for determining a geodetic position and heading thereof. The glider includes an umbilical cable connecting the float to a sub. The sub has wings operable to provide forward movement to the float when lifted and lowered by wave action on the surface of a body of water. At least one geophysical sensor streamer is coupled to the sub. The at least one geophysical sensor streamer has a directional sensor proximate a connection between the sub and one end of the at least one geophysical sensor streamer to measure an orientation of the streamer with respect to a heading of the float.

Abstract: The invention relates to microscopic structures and methods of making and using the structures. A method of forming a microscopic structure of a material includes obtaining a solution (310) containing the material, establishing a flowing stream of the solution (310) in a capillary (104), wherein the capillary (104) has an inner dimension that is smaller than about 300 micrometers, and maintaining the stream until a layer is built up along an inner wall of the capillary (104) from material deposited from the flowing stream, thereby forming a microscopic structure.

Abstract: A method for acquiring marine seismic data includes towing a seismic energy source in a body of water and towing a seismic sensor at a selected distance from the seismic energy source. The seismic energy source is actuated a plurality of positions, a distance between each of the plurality of actuations being randomly different than any other such distance. Seismic energy detected by the seismic sensor is substantially continuously recorded through a plurality of actuations of the at least one seismic energy source. The recording includes recording a geodetic position of the at least one seismic energy source and the at least one seismic sensor at each actuation.

Abstract: A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

Abstract: A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

Abstract: A transducer package 20 includes a substrate 32 having a first axis of symmetry 36 and a second axis of symmetry 38 arranged orthogonal to the first axis of symmetry 36. At least a first sensor 50 and a second sensor 52 each of which are symmetrically arranged on the substrate 32 relative to one of the first and second axes of symmetry 36 and 38.The first and second sensors 50 and 52 are adapted to detect movement parallel to the other of the first and second axes of symmetry 36 and 38. The first sensor 50 is adapted to detect movement over a first sensing range and the second sensor 52 is adapted to detect movement over a second sensing range, the second sensing range differing from the first sensing range.

Abstract: The invention relates to microscopic structures and methods of making and using the structures. A method of forming a microscopic structure of a material includes obtaining a solution (310) containing the material, establishing a flowing stream of the solution (310) in a capillary (104), wherein the capillary (104) has an inner dimension that is smaller than about 300 micrometers, and maintaining the stream until a layer is built up along an inner wall of the capillary (104) from material deposited from the flowing stream, thereby forming a microscopic structure.

Abstract: Disclosed herein are systems that include: (a) an objective lens system configured to collect light from a sample; (b) a first aperture positioned to allow a portion of the collected light received from the objective lens system to pass as input light; (c) a first lens positioned to transmit the input light received from the first aperture; (d) a dispersive element configured to spatially disperse the input light received from the first lens in a first plane; (e) a second lens positioned to transmit the spatially dispersed light; (f) a second aperture positioned to allow a portion of the spatially dispersed light received from the second lens to pass as detection light; and (g) a detector positioned to receive the detection light and configured to form at least one image of the sample.