Abstract: In a multilayer metallisation/dielectric structure on a silicon substrate a trimmable capacitor is formed between two of the higher metallisation layers, with one layer being segmented and the individual segments connected by way of one or more vias and respective narrow links to one terminal of the capacitor. The narrow links are formed from titanium tungsten on the oxide isolated silicon substrate.

Abstract: A bare die testing apparatus comprising a multilayer interconnection structure 10 having a testing station 11 for testing the bare die 20, testing circuits and components 12 arranged in said structure adjacent the testing station 11, said testing station 11 having a plurality of microbumps 17 of conductive material soldered onto wettable metallization pads 18 located on interconnection trace terminations of the interconnection structure, said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components 12. The microbumps 17 are distributed in a pattern corresponding to the pattern of contact pads 19 on a bare die 20 to be tested.

Abstract: A hybrid structure comprising a lens 10, an antenna array 8 and a semiconductor microcircuit 2. The antenna array 8 is formed on a surface of the lens 10 or on a surface of a substrate 14 having substantially the same refractive index as the material of the lens 10. Metal bump bonds 6, 12 provide connections between the antenna array 8 and the semiconductor microcircuit 2.

Abstract: A flip-chip solder bonding arrangement including a semiconductor substrate having thereon layers of metallization which have a tendency to interact with a solder material, forming on said layers of metallization a barrier metallization layer which is not reactive with said solder material, forming solder pads on the barrier layer and thereafter forming solder bonds with such solder pads employing said solder material.

Abstract: A flip-chip solder bonding structure having first and second components. Each component is made from a substrate haivng on one surface an array of solderable pads. Selected pads have solder bumps deposited thereon with each surface having a plurality of alignment marks formed thereon whereby when the components are positioned face to face, the arrays register with one another to enable a solder bond to be formed. The respective pluralities of alignment marks may be inspected to assess their relative positions in order to determine the accuracy of the solder bond. The solderable pads and the alignment marks on each surface are formed during the same processing stage as metallized regions. The solder bumps are applied to the metallized regions forming the alignment marks.

Abstract: A dry solder reflow process, in which metal surface oxides are removed from the solder surface by abstraction of the oxygen from the metal oxide by atomic hydrogen, the atomic hydrogen being created within an intense microwave frequency plasma of a gas containing hydrogen.

Abstract: A thermal detector of the type comprising an array of discrete detector elements each of which is supported by a common supportive layer, each of which is provided in thermal contact with a corresponding collector of radiation absorbent material, the area of each collector being larger than the area of the corresponding detector element, characterized in that contact between each collector and the supportive layer is restricted to an area lying substantially within and displaced from the edge periphery of said collector.

Abstract: A reticulated pyroelectric target, for the detection of infra red radiation, comprising a plurality of closely packed islands of pyroelectric material separated by a plurality of relatively narrow grooves in which in order to physically strengthen the target the islands and grooves are so shaped that the grooves do not form a straight line over any appreciable portion of the target surface. Preferably the islands are hexagonal to provide a good packing density.

Abstract: A thick film resistor suitable for deposition on a copper printed circuit is produced by providing a resistor pattern of a mixture of metal powder and oxide of the metal and heating in a nitrogen atmosphere at a temperature such that the metal and the metallic oxide react to produce a conducting lower oxide.

Abstract: A material for use in making electrical contacts is produced in a powder form suitable for later processing into electrical contacts by standard metallurgical techniques. The material consists of a first metal, such as silver, and the oxide of a second metal, such as cadmium, added to the first metal in a proportion up to the limits of solubility of the second metal in the first metal. An oxide of a third metal having a low electronic work function level, such as lithium oxide, is added and uniformly distributed on the surfaces of the powder particles by precipitation. A fourth metal, such as tellurium, that is insoluble in the first metal is also added to provide selected characteristics.

Abstract: A material for use in making electrical contacts is produced in a powder form suitable for later processing into electrical contacts by standard metallurgical techniques. The material consists of a first metal, such as silver, and the oxide of a second metal, such as cadmium, added to the first metal in a proportion up to the limits of solubility of the second metal in the first metal. An oxide of a third metal having a low electronic work function level, such as lithium oxide, is added and uniformly distributed on the surfaces of the powder particles by precipitation. A fourth metal, such as tellurium, that is insoluble in the first metal is also added to provide selected characteristics.