Abstract: An optical connector is secured to a body member which can be rotated away from the outer surface faceplate of the circuit pack for inspection, cleaning or repair. The body member is otherwise constrained to move along the outer surface of the circuit pack in a fixed path such that the connector of one module can mate through an adapter with a corresponding connector on another module.

Abstract: An electronics enclosure is provided with passive thermal management for a high power electronic units, for example a power amplifier for wireless telecommunications, the enclosure being suitable for mast head mounted units, or remotely located units exposed to a wide range of weather conditions. The use of heat pipes in place of a conventional heat sink provides for natural convection cooling and eliminates the need for fans. Appropriate selection of materials, using copper and aluminum respectively, for the construction of heat pipe and cooling fin assemblies provides a significant reduction in weight and volume is achieved relative to know units having conventional heatsinks and forced air convection cooling. Since the heat pipe efficiency decreases at low temperature, the power amplifier self heats the unit in cold weather and eliminates the need for heaters. This further reduces the power consumption and the size of the unit.

Abstract: Electronic unit of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The units are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each unit, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.

Abstract: Electronic module of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The modules are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each module, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.