Abstract: A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.

Abstract: The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.

Abstract: A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.

Abstract: An absorbent dressing is described which comprises a crosslinked hydrophilic gel absorbent layer comprising a first component polymer comprising a plurality of polymerized monomer units having pendent hydrophilic groups, and pendent Michael donor groups; and a crosslinking agent comprising at least two Michael acceptor groups.

Abstract: A curable composition is described, including a gel material derived from the curable composition, and medical articles including such material, wherein the transparent gel material includes a polymerized monofunctional poly(alkylene oxide) macromonomer component and a surface modified nanoparticle component.

Abstract: An adhesive composition including an etchant for a hard tissue surface, at least one multifunctional crosslinkable (meth)acrylate monomer with a functionality greater than 4, and water. The adhesive composition is a water-in-oil emulsion.

Abstract: A curable composition is described, including a gel material derived from the curable composition, and medical articles including such material, wherein the transparent gel material includes a polymerized monofunctional poly(alkylene oxide) macromonomer component and a surface modified nanoparticle component.

Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

Abstract: A curable composition is described, including a gel material derived from the curable composition, and medical articles including such material, wherein the transparent gel material includes a polymerized monofunctional poly(alkylene oxide) macromonomer component and a surface modified nanoparticle component.

Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

Abstract: The invention features dental compositions comprising at least one hybrid monomer that comprises a cyclic allylic sulfide moiety attached to a (meth)acryloyl moiety. These two functional moieties are typically joined either directly to each via a chemical bond or through some chemical structure or spacer molecule. The composition may optionally contain additional polymerizable compounds, such as ethylenically unsaturated compounds, that are typically used in dental compositions.

Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

Abstract: An adhesive composition including an etchant for a hard tissue surface, at least one multifunctional crosslinkable (meth)acrylate monomer with a functionality greater than 4, and water. The adhesive composition is a water-in-oil emulsion.

Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

Abstract: The present invention features a hardenable dental composition that contains: (1) at least one cyclic allylic compound having at least one sulfur atom in the ring, and (2) at least one at least one ethylenically unsaturated compound, such as a substituted (meth)acryloyl compound. The compositions also typically comprise an initiator system, preferably a photoinitator system containing at least 0.08 wt-% of one or more photosensitizers.

Abstract: A flexible light guide including a material having a tensile modulus of about 1 MPa to about 70 MPa, a Tg of about ?5° C. to about 45° C., an absorbance in the visible spectrum of less than about 0.0279 cm?1, a refractive index of about 1.35 to about 1.65, and a thickness of about 50 microns to about 700 microns.

Abstract: The invention features compositions comprising at least one monomer that comprises a cyclic dithiane moiety attached to a (meth)acryloyl moiety. The composition may optionally contain additional polymerizable compounds, such as ethylenically unsaturated compounds, that are typically used in dental compositions.

Abstract: The present invention provides crosslinkable compositions useful in the preparation of hydrophilic gels, and are prepared from polymers having pendent hydrophilic groups, and pendant Michael donor groups, and crosslinked by polyacryl Michael acceptor compounds.