Patents by Inventor David J. Schifferle

David J. Schifferle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device encapsulation method
    Patent number: 5357673
    Abstract: In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.
    Type: Grant
    Filed: October 1, 1993
    Date of Patent: October 25, 1994
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Polak, David J. Schifferle, Tom Wang
  • Semiconductor device having encapsulation comprising of a thixotropic fluorosiloxane material
    Patent number: 5258650
    Abstract: In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.
    Type: Grant
    Filed: August 26, 1991
    Date of Patent: November 2, 1993
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Polak, David J. Schifferle, Tom Wang