Abstract: One embodiment of a printhead servicing mechanism includes a driveshaft, and a sled including a rack adapted to selectively engage the driveshaft and a retaining wall positioned to retain the driveshaft on the rack in a zone.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: A pen having a printhead and a chamber for holding ink; a sensor for monitoring changes in the amount of ink in the chamber; and a pump for selectively drawing ink into or expelling ink from the chamber.

Abstract: A system for receiving and recycling ink comprises a print cartridge having a printhead, and an ink supply reservoir fluidly connected to the print cartridge and a seal member coupled to the ink supply reservoir. The seal member defines a fluid path into the reservoir and the print cartridge engages the seal member so that ink spit from the printhead flows through the fluid path into the reservoir.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: A printhead servicing mechanism comprises a gear assembly actuated by a printhead carriage to move between an engaged position and a disengaged position, and a printhead servicing device actuated by the gear assembly in the engaged position.

Abstract: A printhead servicing mechanism comprises a printhead capping device that moves between a storage position and a printhead capping position, and a crank arm assembly that moves the printhead capping device between the storage and capping positions.

Abstract: A printhead servicing mechanism comprises a gear assembly actuated by a printhead carriage to move between an engaged position and a disengaged position, and a printhead servicing device actuated by the gear assembly in the engaged position.

Abstract: A printhead servicing mechanism comprises a printhead capping device that moves between a storage position and a printhead capping position, and a crank arm assembly that moves the printhead capping device between the storage and capping positions.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: A system for receiving and recycling ink comprises a print cartridge having a printhead, and an ink supply reservoir fluidly connected to the print cartridge and a seal member coupled to the ink supply reservoir. The seal member defines a fluid path into the reservoir and the print cartridge engages the seal member so that ink spit from the printhead flows through the fluid path into the reservoir.

Abstract: A pen having a printhead and a chamber for holding ink; a sensor for monitoring changes in the amount of ink in the chamber; and a pump for seletively drawing ink into or expelling ink from the chamber.

Abstract: A pen having a printhead and a chamber for holding ink; a sensor for monitoring changes in the amount of ink in the chamber; and a pump for selectively drawing ink into or expelling ink from the chamber.

Abstract: A pen having a printhead and a chamber for holding ink; a sensor for monitoring changes in the amount of ink in the chamber; and a pump for selectively drawing ink into or expelling ink from the chamber.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: The present invention includes as one embodiment a capping station for a fluid ejection device having a snout feature, the capping station comprising a cap with a rigid body and a gland seal disposed around an inner perimeter of a cavity defined by the rigid body for resiliently receiving side portions of the snout feature of the fluid ejection device to create a seal with the fluid ejection device.

Abstract: A printhead for an inkjet printer employs asymmetric orifices, such as an egg-shaped orifice, at the surface of the orifice plate to cause the ink drop tail to be severed at a predictable location from the orifice. The controlled tail and diminished spray of an ink droplet expelled from the asymmetric orifice results in improved edge roughness and improved quality of print.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.