Patents by Inventor David Jacob Lando

David Jacob Lando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with high density I/O lead connection
    Patent number: RE36894
    Abstract: Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the ringers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.
    Type: Grant
    Filed: April 19, 1994
    Date of Patent: October 3, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Lawrence Arnold Greenberg, David Jacob Lando