Patents by Inventor David James Alcoe
David James Alcoe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6740959Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.Type: GrantFiled: August 1, 2001Date of Patent: May 25, 2004Assignee: International Business Machines CorporationInventors: David James Alcoe, Jeffrey Thomas Coffin, Michael Anthony Gaynes, Harvey Charles Hamel, Mario J. Interrante, Brenda Lee Peterson, Megan J. Shannon, William Edward Sablinski, Christopher Todd Spring, Randall Joseph Stutzman, Renee L. Weisman, Jeffrey Allen Zitz
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Patent number: 6654250Abstract: A structure and technique for forming an I/C chip module and circuit card construction is provided. An I/C chip module having a flexible substrate, with first and second opposite sides concave, results from the CTE mismatch between the I/C chip and substrate. The I/C chip module is mounted on a flexible circuit card by solderball connection. The curvature of the I/C chip module causes the circuit card to curve correspondingly. A heatsink in thermal contact with the I/C chip places pressure on the I/C chip module in a direction to decrease the curvature. A rigid backing member retains the circuit card, generating a curved space between the backing member and the circuit card. A leaf spring applies pressure to the I/C chip module against the backing member. A compliant member is interposed between the backing member and the circuit board filling a portion of the curved space therebetween.Type: GrantFiled: September 25, 2002Date of Patent: November 25, 2003Assignee: International Business Machines CorporationInventor: David James Alcoe
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Publication number: 20030025180Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.Type: ApplicationFiled: August 1, 2001Publication date: February 6, 2003Applicant: International Business Machines CorporationInventors: David James Alcoe, Jeffrey Thomas Coffin, Michael Anthony Gaynes, Harvey Charles Hamel, Mario J. Interrante, Brenda Lee Peterson, Megan J. Shannon, William Edward Sablinski, Christopher Todd Spring, Randall Joseph Stutzman, Renee L. Weisman, Jeffrey Allen Zitz
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Patent number: 6255136Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: January 5, 1999Date of Patent: July 3, 2001Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 6245186Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: January 5, 1999Date of Patent: June 12, 2001Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 6060341Abstract: An electronic package is made by electrically bonding groups of conductive leads to two circuitized members after aligning the leads with electrical conductors on the circuitized members. Retention members may be used to hold the leads in alignment relative to each other prior to bonding and then are removed. Removal may include tearing away the retention member in propinquity to notches in the leads.Type: GrantFiled: January 12, 1998Date of Patent: May 9, 2000Assignee: International Business Machines CorporationInventors: David James Alcoe, Frank Edward Andros
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Patent number: 6051982Abstract: A test apparatus including at least one probe member precisely aligned using two spaced apart means (e.g., thin layers) such that the probe can effectively engage a conductor (e.g., solder ball) on an electronic module (e.g., ball grid array package). A compressible member (e.g., elastomeric body) is used to bias the probe toward the conductor. Various probe cross-sectional configurations are also provided. As taught herein, the probe electrically contacts one of the spaced apart means, also conductive, to thus form a circuit which can extend externally of the apparatus (e.g., for connecting to appropriate testing equipment).Type: GrantFiled: April 9, 1997Date of Patent: April 18, 2000Assignee: International Business Machines CorporationInventors: David James Alcoe, David Vincent Caletka
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Patent number: 5947750Abstract: An elastomeric structure including two layers, the first having patterned openings therein and adjacent web members, the second including a patterned array of upstanding projections. The openings and projections may be of cylindrical, rectangular, or other configurations and are oriented in highly dense patterns. The elastomeric is positioned with and attached to a base member having a sidewall substantially as high as the corresponding external side surface of the elastomeric's first layer. The sidewall constrains the elastomeric during compression. The invention thereby substantially prevents lateral expansion of the elastomeric's side surface and lateral deflection of both layers, resulting in a uniform distribution of compressive forces on the upstanding projections.Type: GrantFiled: April 30, 1997Date of Patent: September 7, 1999Assignee: International Business Machines CorporationInventors: David James Alcoe, William Louis Brodsky, David Vincent Caletka
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Patent number: 5877043Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.Type: GrantFiled: February 23, 1998Date of Patent: March 2, 1999Assignee: International Business Machines CorporationInventors: David James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson
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Patent number: 5863814Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: July 1, 1997Date of Patent: January 26, 1999Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 5804984Abstract: A test apparatus including at least one probe member precisely aligned using two spaced apart means (e.g., thin dielectric layers having copper thereon) such that the probe can effectively engage a conductor (e.g., solder ball) on an electronic module (e.g., ball grid array package). A compressible member (e.g., elastomeric body) is used to bias the probe toward the conductor. Various probe cross-sectional configurations are also provided.Type: GrantFiled: August 2, 1996Date of Patent: September 8, 1998Assignee: International Business Machines CorporationInventors: David James Alcoe, David Vincent Caletka
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Patent number: 5786635Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: December 16, 1996Date of Patent: July 28, 1998Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 5760465Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.Type: GrantFiled: February 1, 1996Date of Patent: June 2, 1998Assignee: International Business Machines CorporationInventors: David James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson