Abstract: A robust thick film conductor construction making an electric circuit connection of an electric component (20) to a Ag:Pd conductor (12) on a substrate. A substantially pure Ag conductor (10) is printed, dried, and fired on the substrate, then the Ag:Pd conductor is printed, dried, and fired such that a portion of the latter overlaps a portion of the Ag conductor. A first solder layer (16) is printed over the Ag conductor, including the overlap region (14), and reflowed. A second solder layer (18) is printed over the first printed solder layer at a region where the component (20) is to be placed and is reflowed after placement of the component to thereby join with the component.