Patents by Inventor David James Lentz

David James Lentz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Critical dimension control during template formation
    Patent number: 8545709
    Abstract: Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: October 1, 2013
    Assignee: Molecular Imprints, Inc.
    Inventors: Cynthia B. Brooks, Dwayne L. LaBrake, Niyaz Khusnatdinov, Michael N. Miller, Sidlgata V. Sreenivasan, David James Lentz, Frank Y. Xu
  • CRITICAL DIMENSION CONTROL DURING TEMPLATE FORMATION
    Publication number: 20120187085
    Abstract: Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
    Type: Application
    Filed: April 6, 2012
    Publication date: July 26, 2012
    Applicant: Molecular Imprints, Inc.
    Inventors: Cynthia B. Brooks, Dwayne L. LaBrake, Niyaz Khusnatdinov, Michael N. Miller, Sidlgata V. Sreenivasan, David James Lentz, Frank Y. Xu
  • CRITICAL DIMENSION CONTROL DURING TEMPLATE FORMATION
    Publication number: 20090212012
    Abstract: Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
    Type: Application
    Filed: February 25, 2009
    Publication date: August 27, 2009
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Cynthia B. Brooks, Dwayne L. LaBrake, Niyaz Khusnatdinov, Michael N. Miller, Sidlgata V. Sreenivasan, David James Lentz, Frank Y. Xu