Patents by Inventor David JAPP

David JAPP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heatsink for a memory and routing module
    Patent number: 12588501
    Abstract: A heatsink is provided for a memory and routing module with a lower and upper side, both sides having multiple semiconductor chips attached. The lower side of the module has a connection component attached for connection to a motherboard. The heatsink includes a module receiving region configured to receive a lower side of the module, including a first thermally conductive portion arranged to face the semiconductor chips, an aperture through the lower heatsink component and a thermally conductive peripheral region disposed around the module receiving region. The heatsink includes an upper heatsink component which is configured to connect to the lower heatsink component at the peripheral region to retain the module. The upper heatsink component includes a lower side. The lower side includes a second thermally conductive portion arranged to face the semiconductor chips disposed on an upper side of the module and multiple second heat dissipating elements.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: March 24, 2026
    Assignee: GRAPHCORE LIMITED
    Inventors: Stephen Bodiley, David Japp, Stephen Felix
  • Heatsink for a Memory and Routing Module
    Publication number: 20230282539
    Abstract: A heatsink is provided for a memory and routing module with a lower and upper side, both sides having multiple semiconductor chips attached. The lower side of the module has a connection component attached for connection to a motherboard. The heatsink includes a module receiving region configured to receive a lower side of the module, including a first thermally conductive portion arranged to face the semiconductor chips, an aperture through the lower heatsink component and a thermally conductive peripheral region disposed around the module receiving region. The heatsink includes an upper heatsink component which is configured to connect to the lower heatsink component at the peripheral region to retain the module. The upper heatsink component includes a lower side. The lower side includes a second thermally conductive portion arranged to face the semiconductor chips disposed on an upper side of the module and multiple second heat dissipating elements.
    Type: Application
    Filed: February 27, 2023
    Publication date: September 7, 2023
    Inventors: Stephen BODILEY, David JAPP, Stephen FELIX