Abstract: A system for interfacing Ethernet with SpaceWire comprises a processor including an Ethernet MAC, and a bridge device connected between the processor and a SpaceWire subsystem or network. The bridge device comprises a SpaceWire physical interface that receives SpaceWire data packets, and an Ethernet MAC packet builder that includes digital logic for segmentation of the data packets into Ethernet compatible packet segments. An Ethernet media independent interface receives the packet segments from the packet builder and outputs the packet segments to the Ethernet MAC. The Ethernet media independent interface also receives Ethernet data packets transmitted from the Ethernet MAC.

Abstract: A system for interfacing Ethernet with SpaceWire comprises a processor including an Ethernet MAC, and a bridge device connected between the processor and a SpaceWire subsystem or network. The bridge device comprises a SpaceWire physical interface that receives SpaceWire data packets, and an Ethernet MAC packet builder that includes digital logic for segmentation of the data packets into Ethernet compatible packet segments. An Ethernet media independent interface receives the packet segments from the packet builder and outputs the packet segments to the Ethernet MAC. The Ethernet media independent interface also receives Ethernet data packets transmitted from the Ethernet MAC.

Abstract: A processing unit comprises a plurality of individual integrated circuits (ICs) electrically connected to one another via a common configuration of electrical interconnects (e.g., through-silicon vias). At least two of the ICs may be configured for a different function. In some examples, the processing unit is formed by selecting the ICs from stored groups of ICs. The stored ICs can be, for example, modular ICs in that the ICs can be mixed and matched in any suitable number or type in order to meet a particular set of functional requirements for the processing unit, which may depend on the application for the processing unit. Electrical coupling of these individual ICs via the electrical interconnects of the ICs results in a single processing unit that is configured to perform functions specifically suited for a particular application or set of applications.