Patents by Inventor David John LEES

David John LEES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tamper resistant electronic hardware assembly with a non-functional die used as a protective layer
    Patent number: 10181430
    Abstract: An electronic hardware assembly including at least a first and second laminar component, wherein the first laminar components includes a die, the die including a substrate, a functional region and a first protective layer, and the second laminar component includes a second protective layer, wherein the first and second laminar components are arranged in a stack such that the functional region of the first laminar component is arranged within the assembly substantially between first and second protective layers.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: January 15, 2019
    Assignee: QINETIQ LIMITED
    Inventors: Nigel Clement Davies, David John Lees
  • ELECTRONIC HARDWARE ASSEMBLY
    Publication number: 20160155679
    Abstract: An electronic hardware assembly including at least a first and second laminar component, wherein the first laminar components includes a die, the die including a substrate, a functional region and a first protective layer, and the second laminar component includes a second protective layer, wherein the first and second laminar components are arranged in a stack such that the functional region of the first laminar component is arranged within the assembly substantially between first and second protective layers.
    Type: Application
    Filed: June 27, 2014
    Publication date: June 2, 2016
    Applicant: QINETIQ LIMITED
    Inventors: Nigel Clement DAVIES, David John LEES