Abstract: A low inductance magnetic write head is provided with first and second pole piece layers that have first ends separated by a write gap layer and second ends connected together at a back gap. An insulation stack is provided which is sandwiched between the first and second pole piece layers. A write coil layer and a second coil layer are provided wherein each coil layer has inner and outer ends. The coil layers wind in the same direction from their inner ends to their outer ends. Each of the coil layers has first and second layer portions. The first layer portion of the write coil layer is embedded in the insulation stack. The second pole piece layer is sandwiched between the first portion of the write coil and a non-magnetic layer and the first non-magnetic layer is sandwiched between the second pole piece layer and the first portion of the second coil layer.

Abstract: A magnetic head structure including a magnetoresistive (MR) head and an inductive head for data storage devices such as tape drives. A method of fabricating a magnetic head utilizing semiconductor-type processing techniques is described that produces an inductive head gap having a substantially flat planar structure throughout in length which, in one embodiment, has a length of 150 microns and a height of one micron. The structure includes a first and second shield, and an MR layer formed therebetween that includes an MR sensor adjacent to the air bearing surface (ABS), leads connected on opposite sides of the MR sensor, and isolated segments situated between the leads and extending all the way to the ABS. A trench (i.e. gap) is formed between the leads and the segments. Preferably, the leads and the segments are deposited simultaneously, and the insulating gap is formed subsequently by photoresist and masking techniques.

Abstract: A method of lapping the air bearing surface of a magnetoresistive head which minimizes the likelihood of interelement shorts at the air bearing surface is described. In a final, linear lapping phase, the air bearing surface is lapped back and forth parallel to the longitudinal axis of the head elements in an oscillatory path across a stationary lapping surface. Any scratches or smears of the elements will be along the length of the elements rather than transverse to the elements. Any transverse scratches or smears occurring in earlier lapping phases will be removed during the linear lapping phase.

Abstract: A monitoring apparatus is provided for determining permeabilities of a vacuum-deposited second pole piece of a magnetic head at the wafer level by providing wafer-mounted monitors which have layers formed by the same masking and deposition steps employed in making the magnetic heads so that the layers of the monitors are replicated layers, except for a shaping layer on top of a replicated second pole piece of some of the monitors. Each monitor is a transformer wherein each of a primary winding and a secondary winding comprises essentially a replicated magnetic head. The first and second pole pieces of the replicated magnetic heads are joined so as to magnetically couple the primary and secondary windings that constitute the transformer.

Abstract: According to the present grinding method, a plurality of optical markers are formed by photolithography such that the markers are embedded in a chiplet having a magnetic head. Markers are preferably in the shape of a bar having predetermined height, width and length and are spaced from each other by a predetermined distance where one end of the bars are sequentially offset from each other by a predetermined amount. During coarse grinding of the magnetic head as the magnetic head surface material is ground away, the end-face of the bars, one at a time, become visible. The closer the grinding surface approaches the desired inductive throat or MR element height, more end-faces become visible. Coarse grinding continues until a predetermined number of end-faces become visible at which point the grinding process is terminated and the magnetic head is ready for the final lapping process.