Patents by Inventor DAVID JOSEPH MONK

DAVID JOSEPH MONK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9784787
    Abstract: An electric field sensor includes sense and reference cells. The sense cell produces a resistance that varies relative to an intensity of an electric field, and the reference cell produces a resistance that is invariable relative to the intensity of the electric field. An output signal indicative of the intensity of the electric field is determined using the difference between the resistances. A system includes an electric field source that outputs a digital test program as an electric field signal. The system further includes the electric field sensor formed with IC dies on a wafer. The electric field sensor receives the electric field signal. The received electric field signal is converted to the test program, and the test program is stored in memory on the wafer. The electric field source does not physically contact the dies, but can flood an entire surface of the wafer with the electric field signal.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: October 10, 2017
    Assignee: NXP USA, Inc.
    Inventors: Lianjun Liu, Philippe Bernard Roland Lance, David Joseph Monk, Babak A Taheri
  • Publication number: 20160306007
    Abstract: An electric field sensor includes sense and reference cells. The sense cell produces a resistance that varies relative to an intensity of an electric field, and the reference cell produces a resistance that is invariable relative to the intensity of the electric field. An output signal indicative of the intensity of the electric field is determined using the difference between the resistances. A system includes an electric field source that outputs a digital test program as an electric field signal. The system further includes the electric field sensor formed with IC dies on a wafer. The electric field sensor receives the electric field signal. The received electric field signal is converted to the test program, and the test program is stored in memory on the wafer. The electric field source does not physically contact the dies, but can flood an entire surface of the wafer with the electric field signal.
    Type: Application
    Filed: September 10, 2015
    Publication date: October 20, 2016
    Inventors: LIANJUN LIU, PHILIPPE BERNARD ROLAND LANCE, DAVID JOSEPH MONK, BABAK A. TAHERI