Abstract: Methods for forming a photovoltaic cell electrode structure, wherein the photovoltaic cell includes a semiconductor substrate having a passivation layer thereon, includes providing a plurality of contact openings through the passivation layer to the semiconductor substrate, selectively plating a contact metal into the plurality of contact openings to deposit the contact metal, depositing a metal containing material on the deposited contact metal, and firing the deposited contact metal and the deposited metal containing material. The metal containing material may include a paste containing a silver or silver alloy along with a glass frit and is substantially free to completely free of lead. The methods may also use light activation of the passivation layer or use seed layers to assist in the plating.

Abstract: Provided is a bifacial photovoltaic arrangement comprising a bifacial cell which included a semiconductor layer having a first surface and a second surface, a first passivation layer formed on the first surface of the semiconductor layer and a second passivation layer formed on the second surface of the semiconductor layer, and a plurality of metallizations formed on the first and second passivation layers and selectively connected to the semiconductor layer. At least some of the metallizations on the bifacial photovoltaic arrangement comprising an elongated metal structure having a relatively small width and a relatively large height extending upward from the first and second passivation layers.

Abstract: Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

Abstract: Metallization contact structures and methods for forming a multiple-layer electrode structure on a solar cell include depositing a conductive contact layer on a semiconductor substrate and depositing a metal bearing ink onto a portion of the conductive contact layer, wherein the exposed portions of the conductive contact layer are adjacent to the metal bearing ink. The conductive contact layer is patterned by removing the exposed portions of the conductive contact layer from the semiconductor substrate. The metal bearing ink is aligned with one or more openings in a dielectric layer of the semiconductor substrate and with unexposed portions of the conductive contact layer. The unexposed portions of the conductive contact layer are interposed between the metal bearing ink and the dielectric layer of the semiconductor substrate such that the conductive contact layer pattern is aligned with metal bearing ink.

Abstract: A material set that can be used for making high aspect ratio lines includes a sacrificial feedstock comprising an organic polymer, a solvent, and one or more optional additives, and a functional material that forms a ribbon with the sacrificial feedstock without the sacrificial feedstock and the functional material substantially intermixing, wherein the sacrificial feedstock has a yield strength of greater than about 100 Pa or a viscosity of greater than about 104 cP at a shear rate of less than about 10 sec?1 to enable the ribbon to maintain structural integrity, and the sacrificial feedstock can be removed from the ribbon, leaving the functional material in place with an aspect ratio of greater than about 0.3.

Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract: According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract: A micro-extrusion printhead assembly utilized in a micro-extrusion system to form parallel extruded gridlines of material on a substrate includes a nozzle having a tapered (e.g., triangular or trapezoidal) cross-section arranged such that a lower surface of each gridline is substantially wider than its upper edge, and such that side surfaces of the extruded gridlines reflect incident light beams into exposed surface areas of the substrate, thereby minimizing the effective shadowed surface area under the gridline. In one embodiment, the fluidic channels of each nozzle are fabricated by cutting or etching progressively wider channels into a series of rigid layers, and then stacking the rigid layers to form a layered nozzle structure. In another embodiment, a single layer is processed to include a tapered cross-section having the desired triangular or trapezoidal cross-section.

Abstract: According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

Abstract: In one aspect, an electromechanical switching device is illustrated. The electromechanical switching device includes a relay with at least one first conductive portion, at least one second conductive portion, and at least one actuation component that moves the at least one first conductive portion and the at least one second conductive portion into and out of conductive contact. The at least one first conductive portion includes a conductive stationary end coupled to a substrate and a conductive free-floating end. The at least one actuation component includes an actuation stationary end coupled to the substrate and an actuation free-floating end. The actuation free floating end, when the at least one actuation component is not energized, curls, which curls the conductive free floating end into or out of conductive contact with the at least one second conductive portion.

Abstract: A method and system for a comprehensive security-enhanced rideshare system is provided. The rideshare program includes localization, mapping and ride matching for participants. Participation incentives and revenue methods provide for the financial viability of the rideshare system. Participant security is monitored in near real-time using location-determining communication devices used by the participants in the system. The rideshare system monitors a number of security-indicating criteria and takes action when an anomalous condition is recognized.

Abstract: An electromagnetic tag includes a communication component, which includes an optical transmitter/emitter that transmits/emits optically encoded information.

Abstract: An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.

Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.

Abstract: A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften.

Abstract: Wafer-based solar cells are efficiently produced by extruding a dopant bearing material (dopant ink) onto one or more predetermined surface areas of a semiconductor wafer, and then thermally treating the wafer to cause diffusion of dopant from the dopant ink into the wafer to form corresponding doped regions. A multi-plenum extrusion head is used to simultaneously extrude interdigitated dopant ink structures having two different dopant types (e.g., n-type dopant ink and p-type dopant ink) in a self-registered arrangement on the wafer surface. The extrusion head is fabricated by laminating multiple sheets of micro-machined silicon that define one or more ink flow passages. A non-doping or lightly doped ink is co-extruded with heavy doped ink to serve as a spacer or barrier, and optionally forms a cap that entirely covers the heavy doped ink. A hybrid thermal treatment utilizes a gaseous dopant to simultaneously dope exposed portions of the wafer.

Abstract: Closely spaced, high aspect-ratio gridline structures are formed on the surface of a substrate using two or more co-extrusion heads that co-extrude gridline material and sacrificial material such that the deposited gridline material is compressed between opposing portions of the sacrificial material. The co-extrusion heads include three-channel cavity structures that converge to a relatively small outlet orifice that dispenses the gridline material with relatively fine features and a relatively high aspect ratio. The outlet orifices of the co-extrusion heads are disposed in a staggered arrangement such that gridlines extruded from the first co-extrusion head are disposed between two gridlines extruded from the second co-extrusion head. Photovoltaic cells are produced with metal gridlines formed in this manner.

Abstract: A co-extrusion head for forming high-aspect ratio gridline structures in a micro extrusion apparatus includes multiple sheets (e.g., metal plates) that are machined and assembled to define three-part fluidic channels having associated outlet orifice disposed along an edge surface of the head. Reference surfaces are also etched in the sheets and are aligned in a straight line that intersects output junctions of the three-channel cavities. After assembly (e.g., using high pressure bonding techniques), each reference surface is located inside a notch defined in the edge surface. The edge surface of the co-extrusion head is then trimmed (e.g., machined by wire EDM) using the reference surfaces as a precise guide, thereby producing uniform length outlet orifices with uniform flow impedance.

Abstract: An extrusion head is disposed over a substrate, and material is extruded through an oblique (e.g., semi-circular or tapered) outlet orifice of the extrusion head to form an associated extruded structure having an equilibrium shape that resists settling after being deposited on the substrate. The extrusion head includes fluidic channels having a flat surface formed by a flat first (e.g., metal) sheet, and an oblique (e.g., substantially semi-cylindrical) surface formed by elongated oblique trenches that are etched or otherwise formed in a second sheet. The fluidic channel communicates with the outlet orifice, which has a flat edge formed by the first sheet, and an oblique edge formed by an end of the oblique trench. The material is extruded through the outlet orifice such that its flat lower surface contacts the substrate, and its oblique upper surface faces away from the substrate. Two materials are co-extruded to form high aspect-ratio gridlines.