Abstract: According to one aspect, a method includes determining when a vehicle has arrived at a destination and performing a first authentication process when it is determined that the vehicle has arrived at the destination. The first authentication process being arranged to authenticate a first party to enable the first party to interact with the vehicle. The method also includes determining when the first party has successfully completed the first authentication process, performing a second process when it is determined that the first party has successfully completed the first authentication process, determining whether the second process is successfully completed, and enabling the first party to interact with the vehicle when it is determined that the second process is successfully completed. Performing the second process includes determining when the first party is present within the sensing zone. The first authentication process and the second process are contactless with respect to the vehicle.

Abstract: According to one aspect, a method includes determining when a vehicle has arrived at a destination and performing a first authentication process when it is determined that the vehicle has arrived at the destination. The first authentication process being arranged to authenticate a first party to enable the first party to interact with the vehicle. The method also includes determining when the first party has successfully completed the first authentication process, performing a second process when it is determined that the first party has successfully completed the first authentication process, determining whether the second process is successfully completed, and enabling the first party to interact with the vehicle when it is determined that the second process is successfully completed. Performing the second process includes determining when the first party is present within the sensing zone. The first authentication process and the second process are contactless with respect to the vehicle.

Abstract: Methods of forming colloidal nanocrystal (NC)-based thin film devicesare disclosed. The methods include the steps of depositing a dispersion of NCs on a substrate to form a NC thin-film, wherein at least a portion of the NCs is capped with chalcogenocyanate (xCN)-based ligands; and doping the NC thin-film with a metal.

Abstract: Methods of preparing a dispersion of colloidal nanocrystals (NCs) for use as NC thin films are disclosed. A dispersion of NCs capped with ligands may be mixed with a solution containing chalcogenocyanate (xCN)-based ligands. The mixture may be separated into a supernatant and a flocculate. The flocculate may be dispersed with a solvent to form a subsequent dispersion of NCs capped with xCN-based ligands.

Abstract: Nanocrystal thin film devices and methods for fabricating nanocrystal thin film devices are disclosed. The nanocrystal thin films are diffused with a dopant such as Indium, Potassium, Tin, etc. to reduce surface states. The thin film devices may be exposed to air during a portion of the fabrication. This enables fabrication of nanocrystal-based devices using a wider range of techniques such as photolithography and photolithographic patterning in an air environment.

Abstract: Methods of preparing a dispersion of colloidal nanocrystals (NCs) for use as NC thin films are disclosed. A dispersion of NCs capped with ligands may be mixed with a solution containing chalcogenocyanate (xCN)-based ligands. The mixture may be separated into a supernatant and a flocculate. The flocculate may be dispersed with a solvent to form a subsequent dispersion of NCs capped with xCN-based ligands.

Abstract: Methods of forming colloidal nanocrystal (NC)-based thin film devicesare disclosed. The methods include the steps of depositing a dispersion of NCs on a substrate to form a NC thin-film, wherein at least a portion of the NCs is capped with chalcogenocyanate (xCN)-based ligands; and doping the NC thin-film with a metal.

Abstract: Methods of exchanging ligands to form colloidal nanocrystals (NCs) with chalcogenocyanate (xCN)-based ligands and apparatuses using the same are disclosed. The ligands may be exchanged by assembling NCs into a thin film and immersing the thin film in a solution containing xCN-based ligands. The ligands may also be exchanged by mixing a xCN-based solution with a dispersion of NCs, flocculating the mixture, centrifuging the mixture, discarding the supernatant, adding a solvent to the pellet, and dispersing the solvent and pellet to form dispersed NCs with exchanged xCN-ligands. The NCs with xCN-based ligands may be used to form thin film devices and/or other electronic, optoelectronic, and photonic devices. Devices comprising nanocrystal-based thin films and methods for forming such devices are also disclosed. These devices may be constructed by depositing NCs on to a substrate to form an NC thin film and then doping the thin film by evaporation and thermal diffusion.

Abstract: Nanocrystal thin film devices and methods for fabricating nanocrystal thin film devices are disclosed. The nanocrystal thin films are diffused with a dopant such as Indium, Potassium, Tin, etc. to reduce surface states. The thin film devices may be exposed to air during a portion of the fabrication. This enables fabrication of nanocrystal-based devices using a wider range of techniques such as photolithography and photolithographic patterning in an air environment.

Abstract: Methods of exchanging ligands to form colloidal nanocrystals (NCs) with chalcogenocyanate (xCN)-based ligands and apparatuses using the same are disclosed. The ligands may be exchanged by assembling NCs into a thin film and immersing the thin film in a solution containing xCN-based ligands. The ligands may also be exchanged by mixing a xCN-based solution with a dispersion of NCs, flocculating the mixture, centrifuging the mixture, discarding the supernatant, adding a solvent to the pellet, and dispersing the solvent and pellet to form dispersed NCs with exchanged xCN-ligands. The NCs with xCN-based ligands may be used to form thin film devices and/or other electronic, optoelectronic, and photonic devices. Devices comprising nanocrystal-based thin films and methods for forming such devices are also disclosed. These devices may be constructed by depositing NCs on to a substrate to form an NC thin film and then doping the thin film by evaporation and thermal diffusion.

Abstract: Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.

Abstract: Disclosed are novel methods and apparatus for provision of an efficient, effective, and/or flexible removable HDD cartridge. In accordance with an embodiment of the present invention, an apparatus for holding a removable assembly (3) is disclosed. The apparatus comprising: a cage (2) to hold the assembly, a cage bracket (1) slideably engaging the cage (2), and a latch (6) coupled to the cage. The cage may include a plurality of slide receptacles (20). The assembly may include a plurality of slides (19) slideably engaging the plurality of slide receptacles (20). The cage bracket may be mountable on an external device. The latch may include a latch cap (9) and a locking lip (11). The locking lip may engage a receptacle (12) on the cage bracket to lock together the cage bracket and the cage.

Abstract: A method and apparatus for providing an EMI seal in a system chassis. The EMI seal is provided by a bezel assembly for a storage medium drive. The bezel assembly includes a front bezel having an aperture through which a tray can extend for loading and unloading of the storage medium drive, and a tray bezel attached to the tray. Attached to the front bezel is an electrically conductive link. Both the front bezel and the tray bezel include an electrically conductive inner surface. Upon closing the tray, the electrically conductive link provides an electrical connection between the inner surface front bezel and the inner surface of the tray bezel.

Abstract: Disclosed are novel methods and apparatus for provision of a modular debugger to adapt various chip sizes and/or signal analyzers. In an embodiment of the present invention, an integrated circuit (IC) assembly is disclosed. The IC assembly includes: a printed circuit board (PCB); a plurality of flex circuit connections electrically coupled to the PCB; a carrier electrically coupled to the PCB; a socket electrically coupled to the carrier; an application specific IC (ASIC) electrically coupled to the socket; and a PCB adapter card electrically couplable to at least one of the plurality of flex circuit connections. In another embodiment of the present invention, the PCB adapter card may include at least one connector to provide a communication channel between the ASIC and a signal analyzer.

Abstract: Disclosed are novel methods and apparatus for provision of controlled shapes during the stamping process of sheet metal, for example, used as a computer system enclosure. In accordance with an embodiment of the present invention, a method of providing an irregular shape on a computer panel is disclosed. The method includes: creating a plurality of openings in the computer panel, the plurality of openings tracing a pattern that forms the irregular shape, each of the plurality of openings having a substantially straight edge adjacent to the pattern; and applying force onto the computer panel along the plurality of openings to provide the irregular shape without warping or twisting the computer panel.

Abstract: Disclosed are novel methods and apparatus for provision of a heat dissipation device with improved EMI suppression characteristics. In accordance with an embodiment of the present invention, an apparatus is disclosed. The apparatus may include a printed circuit board, which forms at least one grounding pad and at least one mounting hole. The apparatus may further include an integrated circuit, a heat dissipation device mounted on the integrated circuit, and a frame mounted on the printed circuit board through the mounting hole. The frame may include at least one frame leg in electrical contact with the grounding pad. The frame may form an electromagnetic interference (EMI) shield to limit an EMI leakage generated by the integrated circuit.

Abstract: Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.

Abstract: Disclosed are novel methods and apparatus for provision of an efficient, effective, and/or flexible removable HDD cartridge. In accordance with an embodiment of the present invention, an apparatus for holding a removable assembly (3) is disclosed. The apparatus comprising: a cage (2) to hold the assembly, a cage bracket (1) slideably engaging the cage (2), and a latch (6) coupled to the cage. The cage may include a plurality of slide receptacles (20). The assembly may include a plurality of slides (19) slideably engaging the plurality of slide receptacles (20). The cage bracket may be mountable on an external device. The latch may include a latch cap (9) and a locking lip (11). The locking lip may engage a receptacle (12) on the cage bracket to lock together the cage bracket and the cage.