Abstract: One embodiment of the present invention provides a system that proactively monitors a disk drive to detect an impending disk drive failure. During operation, the system obtains a time-varying electrical signal which is generated by the spindle rotation during operation of the disk drive. Next, the system extracts one or more inferential parameters associated with the spindle rotation from the time-varying electrical signal using a phase-sensitive detection. The system then performs proactive fault detection on the inferential parameters to detect an impending failure of the disk drive.

Abstract: A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.

Abstract: One embodiment of the present invention provides a system that proactively monitors a disk drive to detect an impending disk drive failure. During operation, the system obtains a time-varying electrical signal which is generated by the spindle rotation during operation of the disk drive. Next, the system extracts one or more inferential parameters associated with the spindle rotation from the time-varying electrical signal using a phase-sensitive detection. The system then performs proactive fault detection on the inferential parameters to detect an impending failure of the disk drive.

Abstract: One embodiment of the present invention provides a system that tests the quality and/or the reliability of a component. During operation, the system applies test conditions to a plurality of specimens of the component. While applying the test conditions, the system measures the same variable from each of the plurality of specimens. Next, the system computes a running average of the measured variable across the plurality of specimens. The system then computes residuals between the measured variable for each specimen and the running average. The system next determines from the residuals whether the associated specimens are degraded.

Abstract: A system that characterizes degradation of a component in a system. During operation, the system monitors inferential variables associated with a specimen of the component. Next, the system determines a time for the onset of degradation for the specimen and determines a time for the completion of degradation for the specimen. The system then computes a time interval between the onset of degradation and the completion of degradation, and uses the time interval to look up an entry in a defect library to obtain information which characterizes the degradation of the specimen of the component.

Abstract: A method for assessing a reliability of a complex component having a plurality of similar subcomponents is described. The complex component is divided into a plurality of component parts, each component part including at least one of the subcomponents. Specification ranges are identified for measured variables within which the component parts are considered to be operating within specification. The complex component is subjected to a reliability test and reliability data is obtained for the component parts by comparing the measured variable for each of the component parts with the specification ranges to determine failure times. A system and machine readable medium embodying program instructions is also provided.

Abstract: One embodiment of the present invention provides a system that determines the reliability of a component in a system. During operation, the system monitors inferential variables associated with a number of specimens of the component. The system then collects degradation data by first computing a likelihood value that indicates whether an inferential variable associated with a specimen of the component is behaving normally or abnormally. Next, the system determines whether the specimen of the component has degraded based on the likelihood value. If the specimen of the component is determined to have degraded, the system records the time when the specimen of the component was determined to have degraded. The system also uses the degradation data to determine the reliability of the component in the system.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: One embodiment of the present invention provides a system that facilitates accelerated Soft-Error Rate (SER) testing of circuitry. The system starts by collecting a radioactive gas from the atmosphere and concentrating the radioactive gas in a testing chamber. Once the desired amount of radioactive gas is present in the testing chamber, the system SER tests the circuitry in the testing chamber by bombarding the circuitry with particles emitted from the radioactive gas while running testing procedures.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.

Abstract: A printhead assembly includes a carrier including a substrate and a substructure, and a plurality of printhead dies each mounted on the substrate of the carrier. The substrate includes a first material and the substructure is formed of a second material. As such, the substrate and the substructure are joined by a lap joint.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: A method for increasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperature is disclosed. During the manufacture of the light emitting diode, a liquid coating is applied to the light emitting die after the die has been placed in its lead frame. After the liquid coating has been placed on the die and its lead frames, a thermosetting encapsulant material is placed over the coating. The operation that cures the thermosetting material leaves the coating liquid intact. As the die and the encapsulant expand and contract at different rates with respect to changes in temperature, and as in known light emitting diodes the encapsulating material adheres to the die and lead frames, this liquid coating reduces the stresses that these different rates of expansion and contraction normally cause by eliminating the adherence of the encapsulating material to the die and frame.