Abstract: The present description concerns an electronic device comprising: an electronic chip comprising an active area on a first surface, and a second surface opposite to the first surface; a substrate, the first surface of said chip being mounted on a third surface of said substrate; and a thermally-conductive cover comprising a transverse portion extending at least above the second surface of said electronic chip, wherein the electronic device further comprises at least one thermally-conductive pillar coupling the second surface of the electronic chip to said transverse portion of said thermally-conductive cover.

Abstract: A bumping matrix includes many bumps, wherein each bump is rotationally asymmetric in a plane of the bumping matrix. The bumps are orientated in a centripetal arrangement. Bumps in a first portion of the bumping matrix have a first pitch in a first axis and bumps in a second portion of the bumping matrix have a second pitch in the first axis. The second pitch is different from the first pitch. Bumps have an oblong shape with a longer diameter and a shorter diameter. The centripetal arrangement orients the longer diameter of the bumps is a direction radially extending from a center of the bumping matrix.