Abstract: Systems, methods, and devices are provided for producing and using a low-value inductor which is stable at high frequencies, the inductor including a plurality of radial spokes extending between two concentric rings. The inductance of the inductor is controlled by the number and dimensions of the plurality of spokes, as well as the materials of the inductor. In some cases, the inductor is used as a low value inductance standard for directly measuring a low value electrical inductance.

Abstract: Systems, methods, and devices are provided for producing and using a low-value inductor which is stable at high frequencies, the inductor including a plurality of radial spokes extending between two concentric rings. The inductance of the inductor is controlled by the number and dimensions of the plurality of spokes, as well as the materials of the inductor. In some cases, the inductor is used as a low value inductance standard for directly measuring a low value electrical inductance.

Abstract: A magnetic sensor package having a biasing mechanism involving a coil-generated, resistor-controlled magnetic field for providing a desired biasing effect. In a preferred illustrated embodiment, the package broadly comprises a substrate; a magnetic sensor element; a biasing mechanism, including a coil and a first resistance element; an amplification mechanism; a filter capacitor element; and an encapsulant. The sensor is positioned within the coil. A current applied to the coil produces a biasing magnetic field. The biasing magnetic field is controlled by selecting a resistance value for the first resistance element which achieves the desired biasing effect. The first resistance element preferably includes a plurality of selectable resistors, the selection of one or more of which sets the resistance value.

Abstract: A microsystem enclosure for hermetically sealing and thereby protecting a microsystem located on a substrate from the potentially damaging effects of exposure to moisture, dust, and other external environmental or operating conditions. The enclosure broadly comprises a single-piece hermetic cover structure and a single solder preform. The preform facilitates sealing the cover to the substrate in high-temperature, single-step process so as to create a hermetic cavity wherein the microsystem resides.

Abstract: A microsystem enclosure for hermetically sealing and thereby protecting a microsystem located on a substrate from the potentially damaging effects of exposure to moisture, dust, and other external environmental or operating conditions. The enclosure broadly comprises a single-piece hermetic cover structure and a single solder preform. The preform facilitates sealing the cover to the substrate in high-temperature, single-step process so as to create a hermetic cavity wherein the microsystem resides.

Abstract: A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

Abstract: A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

Abstract: A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

Abstract: A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

Abstract: A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.