Patents by Inventor David Keating Foote

David Keating Foote has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Passivation layer for semiconductor device packaging
    Patent number: 8268675
    Abstract: Methods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protect the cleaned surface of the layer against exposure to an oxidizing gas.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: September 18, 2012
    Assignee: Nordson Corporation
    Inventors: David Keating Foote, James Donald Getty
  • PASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGING
    Publication number: 20120208321
    Abstract: Methods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protect the cleaned surface of the layer against exposure to an oxidizing gas.
    Type: Application
    Filed: February 11, 2011
    Publication date: August 16, 2012
    Applicant: NORDSON CORPORATION
    Inventors: David Keating Foote, James Donald Getty