Patents by Inventor David Kleinschmidt
David Kleinschmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10715650Abstract: Various implementations include dual-transceiver wireless audio systems configured to forward call audio from a first wireless transceiver to a second wireless transceiver over a simple voice forward profile (SVFP) connection. In other implementations, a computer-implemented method is disclosed for controlling a dual-transceiver wireless calling system. In still other implementations, a wireless headphone system is configured to forward call audio from a first headphone to a second headphone over the SVFP connection.Type: GrantFiled: July 15, 2019Date of Patent: July 14, 2020Assignee: Bose CorporationInventors: Sharafuddeen Nalakath, David Kleinschmidt, Pepin Torres
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Publication number: 20190342437Abstract: Various implementations include dual-transceiver wireless audio systems configured to forward call audio from a first wireless transceiver to a second wireless transceiver over a simple voice forward profile (SVFP) connection. In other implementations, a computer-implemented method is disclosed for controlling a dual-transceiver wireless calling system. In still other implementations, a wireless headphone system is configured to forward call audio from a first headphone to a second headphone over the SVFP connection.Type: ApplicationFiled: July 15, 2019Publication date: November 7, 2019Applicant: Bose CorporationInventors: Sharafuddeen Nalakath, David Kleinschmidt, Pepin Torres
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Patent number: 10356232Abstract: Various implementations include dual-transceiver wireless audio systems configured to forward call audio from a first wireless transceiver to a second wireless transceiver over a simple voice forward profile (SVFP) connection. In other implementations, a computer-implemented method is disclosed for controlling a dual-transceiver wireless calling system. In still other implementations, a wireless headphone system is configured to forward call audio from a first headphone to a second headphone over the SVFP connection.Type: GrantFiled: March 22, 2018Date of Patent: July 16, 2019Assignee: BOSE CORPORATIONInventors: Sharafuddeen Nalakath, David Kleinschmidt, Pepin Torres
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Patent number: 8447370Abstract: Among other features, a boom microphone has a microphone connector; an earcup module includes an earcup connector jack to connect to a headphone and a boom lead-in to receive the microphone connector; and a control module communicates voice signals wirelessly between (a) the boom microphone and headphone and (b) a telephone.Type: GrantFiled: April 4, 2011Date of Patent: May 21, 2013Assignee: Bose CorporationInventors: Joji Ueda, David Kleinschmidt
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Publication number: 20110230239Abstract: Among other features, a boom microphone has a microphone connector; an earcup module includes an earcup connector jack to connect to a headphone and a boom lead-in to receive the microphone connector; and a control module communicates voice signals wirelessly between (a) the boom microphone and headphone and (b) a telephone.Type: ApplicationFiled: April 4, 2011Publication date: September 22, 2011Inventors: Joji Ueda, David Kleinschmidt
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Patent number: 7970159Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: GrantFiled: June 25, 2008Date of Patent: June 28, 2011Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Patent number: 7920903Abstract: Among other features, a boom microphone has a microphone connector; an earcup module includes an earcup connector jack to connect to a headphone and a boom lead-in to receive the microphone connector; and a control module communicates voice signals wirelessly between (a) the boom microphone and headphone and (b) a telephone.Type: GrantFiled: January 4, 2007Date of Patent: April 5, 2011Assignee: Bose CorporationInventors: Joji Ueda, David Kleinschmidt
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Publication number: 20090003616Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: ApplicationFiled: June 25, 2008Publication date: January 1, 2009Applicant: Bose CorporationInventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Patent number: 7412070Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: GrantFiled: March 29, 2004Date of Patent: August 12, 2008Assignee: Bose CorporationInventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Publication number: 20080167092Abstract: Among other features, a boom microphone has a microphone connector; an earcup module includes an earcup connector jack to connect to a headphone and a boom lead-in to receive the microphone connector; and a control module communicates voice signals wirelessly between (a) the boom microphone and headphone and (b) a telephone.Type: ApplicationFiled: January 4, 2007Publication date: July 10, 2008Inventors: Joji Ueda, David Kleinschmidt
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Publication number: 20050213774Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: ApplicationFiled: March 29, 2004Publication date: September 29, 2005Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Patent number: D942963Type: GrantFiled: January 28, 2020Date of Patent: February 8, 2022Assignee: Bose CorporationInventors: Timothy Joseph Bennett, Alexander Decastro Calachan, Joshua Kevin Dryden, Jacob Dewey Dennis, David Kleinschmidt, Kyle Arthur Graham, William Henry Arthur Voigt
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Patent number: D1011310Type: GrantFiled: January 28, 2020Date of Patent: January 16, 2024Assignee: Bose CorporationInventors: Timothy Joseph Bennett, Alexander Decastro Calachan, Joshua Kevin Dryden, Jacob Dewey Dennis, David Kleinschmidt, Kyle Arthur Graham, William Henry Arthur Voigt