Abstract: An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material.

Abstract: A method of generating a microfluidic ejection chip is provided. The method includes creating an opening in a silicon substrate through multiple iterations of a deep reactive ion etching process, forming a passivation layer over any exposed portion of silicon at the opening following each iteration of the deep reactive ion etching of the silicon substrate, and not removing the passivation layer at a conclusion of the etching of the silicon substrate to define a fluid passageway at the opening in the silicon substrate, such that the passivation layer is permanent on the silicon substrate at the opening.

Abstract: A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.

Abstract: An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material.

Abstract: A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.

Abstract: A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first layer devoid of a hydrophobicity agent and (b) at least a second layer comprising the hydrophobicity agent. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material.

Abstract: A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first layer devoid of a hydrophobicity agent and (b) at least a second layer comprising the hydrophobicity agent. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material.

Abstract: A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.

Abstract: A fluidic delivery device having improved volumetric efficiency. The device includes a fluid container having a standpipe at a lower end of the container and open areas located below a fluid entrance end of the standpipe; a first fluid permeable body located in the fluid container above the fluid entrance end of the standpipe; and one or more second fluid permeable bodies located in the open areas of the fluid container below the first fluid permeable body and below the fluid entrance end of the standpipe.

Abstract: A fluid ejection head and a method of making a fluid ejection head. The method includes providing a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof. The substrate is reactive ion etched to form one or more fluid supply vias therein. A flow feature layer is laminated to the substrate and is exposed to ultra violet (UV) radiation through a photo mask to provide UV exposed areas of the flow feature layer. The flow feature layer is heated to cross-link material in the UV exposed areas. A nozzle plate layer is laminated to the flow feature layer and exposed to UV radiation through a photo mask to provide UV exposed areas for nozzle holes. The nozzle plate layer is cross-linked with heat and the flow feature layer and nozzle plate layer are developed to form the flow features and nozzle holes in the respective layers.

Abstract: Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.

Abstract: Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.

Abstract: A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrates. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.

Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same.

Abstract: A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.

Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same.

Abstract: Methods of forming a fluid channel in a semiconductor substrate may include providing a semiconductor substrate having a backside and a device side, wherein the device side is configured to secure ink ejecting devices thereon and applying a material layer to the backside of the semiconductor substrate. The method may further include providing a gray scale mask configured with a pattern corresponding to a fluid channel having a plurality of slots, exposing the material layer to sufficient light radiation energy through the gray scale mask and etching the exposed material layer and the semiconductor substrate through to the device side of the semiconductor substrate.

Abstract: A method of making a micro-fluid ejection head structure and structures made by the method. The method includes planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation. A polymeric nozzle layer is laminated to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.

Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same.

Abstract: A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrate. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.