Abstract: A high performance, low-profile semiconductor heat dissipation apparatus that is able to achieve increased heat dissipation efficiency, greater heat dissipation uniformity, and greater heat dissipation control through the use of multiple modes of innovative coolant fluid flow balancing.

Abstract: A low profile semiconductor heat dissipation apparatus utilizing innovative three dimensional flow balancing to achieve both greater thermal efficiency and greater heat dissipation uniformity.

Abstract: An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.

Abstract: An improved, liquid cooled, power semiconductor heat dissipation apparatus configured to accommodate surface-mount power semiconductor devices mounted on direct bond copper plates which are in thermal communication with a heat transfer surface and electrical communication with a printed circuit board or other surface on which the apparatus is mounted.

Abstract: An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.

Abstract: A packaging and cooling apparatus for power semiconductor devices comprising a printed circuit board and a semiconductor module. The semiconductor module having a manifold element and a semiconductor element consisting of power semiconductor devices, thermally conductive plates, and serpentine fin elements. The power semiconductor devices and serpentine fin elements are bonded to the thermally conductive plates on opposing sides to form plate assemblies. The plate assemblies are installed in the windows of the manifold element forming the semiconductor module, which allows for heat removal from each of the power semiconductor devices. The terminals of the semiconductor module are received in the holes of the circuit board, and soldered to traces. The packaging and cooling apparatus may be potted with a resin to prevent leakage of coolant or sealing may be achieved by use of clamped o-rings.