Patents by Inventor David L. Crouthamel

David L. Crouthamel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
    Patent number: 7982307
    Abstract: An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: July 19, 2011
    Assignee: Agere Systems Inc.
    Inventors: Ahmed Amin, David L. Crouthamel, John W. Osenbach, Thomas H. Shilling, Brian T. Vaccaro
  • Low thermal resistance assembly for flip chip applications
    Patent number: 7479695
    Abstract: An assembly comprises a stiffener, a circuit substrate and an integrated circuit (IC) chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers the first region, while the IC chip overlies at least a portion of each of the first and second regions. Moreover, the assembly further comprises a plurality of first solder bumps and a plurality of second solder bumps. The first solder bumps contact both the IC chip and the circuit substrate. The second solder bumps are larger than the first solder bumps, contact the IC chip and are disposed above the second region of the stiffener.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: January 20, 2009
    Assignee: Agere Systems Inc.
    Inventors: Mark Adam Bachman, David L. Crouthamel
  • Flip Chip Assembly Having Improved Thermal Dissipation
    Publication number: 20080116567
    Abstract: An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.
    Type: Application
    Filed: November 22, 2006
    Publication date: May 22, 2008
    Inventors: Ahmed Amin, David L. Crouthamel, John W. Osenbach, Thomas H. Shilling, Brian T. Vaccaro