Abstract: A method for aligning and bonding the outer leads of the conductive fingers of a tape-and-semiconductor-chip sub-assembly to a package substrate is disclosed. Each section of tape is provided with an inner support ring and an outer support ring. The conductive fingers extend from under the inner support ring to under the outer support ring. The outer support ring is spaced away from the inner support ring to expose portions of the tape outer leads therebetween. The tape-and-chip sub-assembly is positioned over the package substrate so the outer leads are in register with the appropriate package substrate leads. A deposit of flux is applied to at least one location between the substrate and outer support ring to bond the sub-assembly to the substrate. The bonded outer support ring prevents the sub-assembly from moving so the leads do not become out of register with the substrate prior to and during the lead bonding process.

Abstract: A novel tape-and-semiconductor chip sub-assembly (10) electrically connects bonding pads (not shown) of a semiconductor chip (13) to corresponding leads (26) on a package substrate (12). This tape-and-semiconductor chip sub-assembly includes a thin electrically insulating film, called an inner support ring (18), that has a central aperture (36) for receiving a semiconductor chip (13). The sub-assembly also includes a plurality of conductive fingers (16) on the underside of the film that extend radially inwards beyond the inner ring's inner perimeter for connection to the chip. The fingers also extend radially outward beyond the inner ring's outer perimeter. A novel outer support ring (22) secures the end of each conductive finger in its proper relative position with respect to the other conductive fingers. The outer ring thus facilitates simultaneous alignment during package assembly of all the conductive fingers with the associated substrate leads to which they are respectively to be bonded.