Patents by Inventor David L. Houck
David L. Houck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11811583Abstract: Methods and systems generating real-time notifications of software application importance based on current processing requirements. The method includes receiving a first dataset, wherein the first dataset comprises recovery time estimates for processing requirements. The method includes receiving a second dataset, wherein the second dataset comprises second recovery time estimates for applications. The method includes receiving a third dataset, wherein the third dataset comprises dependencies between processing requirements and applications. The method determines many-to-many relationships between the processing requirements and applications based on the dependencies. The method inputs the many-to-many relationships into a machine learning model to identify importance metrics for each application. The method generates, for display on a user interface, a ranking of the applications in order of importance metric.Type: GrantFiled: December 6, 2022Date of Patent: November 7, 2023Assignee: Capital One Services, LLCInventors: Jonathan Underwood, David L. Houck, Naoum Anagnos
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Patent number: 7300492Abstract: A novel molybdenum compound, ammonium dodecamolybdomolybdate (AMM), is described which may be used in the manufacture of molybdenum metal and molybdenum carbide powders. The molybdenum compound is a dodecaheteropoly acid salt having a Keggin-type structure wherein molybdenum resides in both the hetero as well as peripheral atomic positions. The novel compound has the general formula (NH4)2Mo12MoO40·6H2O. Because of its low solubility, the compound can be crystallized efficiently and at a high purity from ammonium molybdate solutions.Type: GrantFiled: September 1, 2004Date of Patent: November 27, 2007Assignee: Osram Sylvania Inc.Inventors: Raj P. Singh, Thomas A. Wolfe, David L. Houck
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Patent number: 7122069Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: GrantFiled: March 13, 2001Date of Patent: October 17, 2006Assignee: Osram Sylvania Inc.Inventors: Leonid P Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Patent number: 7045113Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: GrantFiled: September 20, 2002Date of Patent: May 16, 2006Assignee: Osram Sylvania Inc.Inventors: Leonid P Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Patent number: 7041151Abstract: An electrochemical displacement-deposition method for making composite metal powders is described. The method is carried out by combining tungsten or molybdenum metal particles with particles of silver oxide or copper oxide in an aqueous hydroxide solution. Heat is applied to the solution to cause the oxide particles to convert to silver or copper metal particles which are substantially adhered to the refractory metal particles. Unlike conventional methods, it is not necessary to heat the oxide powders to a very high temperature in a reducing atmosphere in order to form the composite metal powder.Type: GrantFiled: January 20, 2004Date of Patent: May 9, 2006Assignee: Osram Sylvania Inc.Inventors: Raj Pal Singh Gaur, Scott A. Braymiller, Thomas A. Wolfe, Michael R. Pierce, David L. Houck
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Patent number: 6793907Abstract: A novel molybdenum compound, ammonium dodecamolybdomolybdate (AMM), is described which may be used in the manufacture of molybdenum metal and molybdenum carbide powders. The molybdenum compound is a dodecaheteropoly acid salt having a Keggin-type structure wherein molybdenum resides in both the hetero as well as peripheral atomic positions. The novel compound has the general formula (NH4)2Mo12MoO40.6H2O. Because of its low solubility, the compound can be crystallized efficiently and at a high purity from ammonium molybdate solutions.Type: GrantFiled: July 29, 2002Date of Patent: September 21, 2004Assignee: Osram Sylvania Inc.Inventors: Raj P. Singh, Thomas A. Wolfe, David L. Houck
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Patent number: 6780219Abstract: A method for spheridizing silicon metal particles is described. The method involves injecting irregular silicon metal particles into a high-temperature plasma reactor to melt at least 50 weight percent of the particles. The molten droplets are solidified to form substantially spherical silicon particles having a thin SiO coating which may be removed by treating with a weak hydroxide solution.Type: GrantFiled: July 3, 2002Date of Patent: August 24, 2004Assignee: Osram Sylvania Inc.Inventors: Raj P. Singh, David L. Houck, Nelson E. Kopatz, Michael R. Pierce, Scott A. Braymiller
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Publication number: 20040149085Abstract: An electrochemical displacement-deposition method for making composite metal powders is described. The method is carried out by combining tungsten or molybdenum metal particles with particles of silver oxide or copper oxide in an aqueous hydroxide solution. Heat is applied to the solution to cause the oxide particles to convert to silver or copper metal particles which are substantially adhered to the refractory metal particles. Unlike conventional methods, it is not necessary to heat the oxide powders to a very high temperature in a reducing atmosphere in order to form the composite metal powder.Type: ApplicationFiled: January 20, 2004Publication date: August 5, 2004Applicant: OSRAM SYLVANIA Inc.Inventors: Raj Pal Singh Gaur, Scott A. Braymiller, Thomas A. Wolfe, Michael R. Pierce, David L. Houck
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Publication number: 20040004301Abstract: A method for spheridizing silicon metal particles is described. The method involves injecting irregular silicon metal particles into a high-temperature plasma reactor to melt at least 50 weight percent of the particles. The molten droplets are solidified to form substantially spherical silicon particles having a thin SiO coating which may be removed by treating with a weak hydroxide solution.Type: ApplicationFiled: July 3, 2002Publication date: January 8, 2004Applicant: OSRAM SYLVANIA Inc.Inventors: Raj P. Singh, David L. Houck, Nelson E. Kopatz, Michael R. Pierce, Scott A. Braymiller
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Publication number: 20030091457Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: ApplicationFiled: September 20, 2002Publication date: May 15, 2003Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Patent number: 6375708Abstract: A W—Cu—Ni alloy having thermophysical properties suitable for use in electrical contacts and electrodes is described. The alloy is formed by direct sintering of a powder blend comprising a tungsten-copper composite powder and a nickel powder. The tungsten-copper composite powder component of the blend comprises individual dual phase particles having a copper phase and a tungsten phase wherein the tungsten phase substantially encapsulates the copper phase. The method for direct sintering the W—Cu—Ni alloy substantially eliminates the formation of brittle intermetallics and slumping during sintering.Type: GrantFiled: August 31, 2000Date of Patent: April 23, 2002Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Michael J. Scheithauer, Muktesh Paliwal, David L. Houck, James R. Spencer
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Publication number: 20020005086Abstract: A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.Type: ApplicationFiled: March 13, 2001Publication date: January 17, 2002Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Anna T. Spitsberg, Jeffrey N. Dann
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Patent number: 6103392Abstract: A high performance W--Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.Type: GrantFiled: November 17, 1995Date of Patent: August 15, 2000Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Gail T. Meyers, Frank J. Venskytis
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Patent number: 5956560Abstract: A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.Type: GrantFiled: January 15, 1997Date of Patent: September 21, 1999Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Muktesh Paliwal, Gail T. Meyers, Frank J. Venskytis
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Patent number: 5897962Abstract: A method of making flowable tungsten/copper composite powder by milling an aqueous slurry of a mixture of the desired weight ratio of tungsten powder and copper oxide powder and, optionally, a small amount of cobalt powder, spray-drying the slurry to form spherical, flowable agglomerates, and reducing the agglomerates in a hydrogen atmosphere.Type: GrantFiled: July 13, 1995Date of Patent: April 27, 1999Assignee: Osram Sylvania Inc.Inventors: David L. Houck, Nelson Kopatz, Muktesh Paliwal, Sanjay Sampath
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Patent number: 5470549Abstract: A method for making a tungsten-copper composite oxide wherein an amount of an ammonium tungstate and an amount of an oxide or hydroxide of copper are combined without milling to form a mixture. The unmilled mixture is then dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide.Type: GrantFiled: December 22, 1994Date of Patent: November 28, 1995Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Nelson E. Kopatz
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Patent number: 5468457Abstract: A method of making a tungsten-copper composite oxide wherein an amount of an oxide of tungsten and an amount of an oxide of copper are combined to form a mixture, the oxide of tungsten or the oxide of copper, or both, being in a hydrated form. The mixture is then milled, dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide, the time sufficient to form the tungsten-copper composite oxide being at least about one-half the time sufficient to form the tungsten-copper composite oxide from a mixture of tungsten trioxide, WO.sub.3, and cupric oxide, CuO, under substantially similar conditions.Type: GrantFiled: December 22, 1994Date of Patent: November 21, 1995Assignee: Osram Sylvania Inc.Inventors: Leonid P. Dorfman, Michael J. Scheithauer, David L. Houck, Nelson E. Kopatz
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Patent number: 5439638Abstract: A method of making flowable tungsten/copper composite powder by milling an aqueous slurry of a mixture of the desired weight ratio of tungsten powder and copper oxide powder and, optionally, a small amount of cobalt powder, spray-drying the slurry to form spherical, flowable agglomerates, and reducing the agglomerates in a hydrogen atmosphere.Type: GrantFiled: July 16, 1993Date of Patent: August 8, 1995Assignee: OSRAM Sylvania Inc.Inventors: David L. Houck, Nelson Kopatz, Muktesh Paliwal, Sanjay Sampath
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Patent number: 5173108Abstract: A method is disclosed for producing an agglomerated molybdenum plasma spray powder with a controlled level of oxygen which comprises forming a relatively uniform mixture of agglomerated powders containing molybdenum dioxide and one or more ammonium-containing compounds of molybdenum wherein the mixture has an oxygen content of greater than about 25% by weight and reducing the mixture in a moving bed furnace at a temperature of from about 700.degree. C. to about 1000.degree. C. for a sufficient time to remove a portion of the oxygen therefrom and form reduced molybdenum powder agglomerates having an oxygen content of no greater than about 25% by weight. The reduction takes place in the direction from the outside surface of the agglometates to the inside surface.Type: GrantFiled: November 12, 1991Date of Patent: December 22, 1992Assignee: GTE Products CorporationInventor: David L. Houck
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Patent number: 5126104Abstract: A method is disclosed for preparing an intimate mixture of powders of nickel-chromium-boron-silicon alloy, molybdenum metal powder, and Cr.sub.3 C.sub.2 /NiCr alloy suitable for thermal spray coatings which comprises milling a starting mixture of the above two alloys with molybdenum powder to produce a milled mixture wherein the average particle size is less than about 10 micrometers in diameter, forming an aqueous slurry of the resulting milled mixture and a binder which can be an ammoniacal molybdate compound or polyvinyl alcohol, and agglomerating the milled mixture and binder. The intimate mixture and binder may be sintered in a reducing atmosphere at a temperature of about 800.degree. C. to 950.degree. C. for a sufficient time to form a sintered partially alloyed mixture wherein the bulk density is greater than about 1.2 g/cc.Type: GrantFiled: June 6, 1991Date of Patent: June 30, 1992Assignee: GTE Products CorporationInventors: Vidhu Anand, Sanjay Sampath, David L. Houck, Jack E. Vanderpool