Patents by Inventor David L. McDonald

David L. McDonald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10974157
    Abstract: An article ejection structure is disclosed, having a housing, and a first biasing member positioned in the housing and having a first biasing force biasing the first biasing member toward a first neutral position to drive a rupture structure to rupture the housing. A release member restricts the first biasing member from moving toward the first neutral position when the release member is in a lock state, and is conditionable to a release state, in which the release member at least partially releases the first biasing member to move toward the first neutral position and drive the ejection structure to rupture the housing. A second biasing member positioned in the housing, the second biasing member having a second biasing force biasing the second biasing member toward a second neutral position to drive an article positioned in the housing out of the housing when the housing is ruptured.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: April 13, 2021
    Assignee: Spin Master Ltd.
    Inventors: Amy A. Pruzansky, David L. McDonald, Tat Wah Wong
  • Publication number: 20200289952
    Abstract: An article ejection structure is disclosed, having a housing, and a first biasing member positioned in the housing and having a first biasing force biasing the first biasing member toward a first neutral position to drive a rupture structure to rupture the housing. A release member restricts the first biasing member from moving toward the first neutral position when the release member is in a lock state, and is conditionable to a release state, in which the release member at least partially releases the first biasing member to move toward the first neutral position and drive the ejection structure to rupture the housing. A second biasing member positioned in the housing, the second biasing member having a second biasing force biasing the second biasing member toward a second neutral position to drive an article positioned in the housing out of the housing when the housing is ruptured.
    Type: Application
    Filed: March 30, 2020
    Publication date: September 17, 2020
    Inventors: Amy A. Pruzansky, David L. McDonald, Tat Wah Wong
  • Patent number: 10603597
    Abstract: An article ejection structure is disclosed, having a housing, and a first biasing member positioned in the housing and having a first biasing force biasing the first biasing member toward a first neutral position to drive a rupture structure to rupture the housing. A release member restricts the first biasing member from moving toward the first neutral position when the release member is in a lock state, and is conditionable to a release state, in which the release member at least partially releases the first biasing member to move toward the first neutral position and drive the ejection structure to rupture the housing. A second biasing member positioned in the housing, the second biasing member having a second biasing force biasing the second biasing member toward a second neutral position to drive an article positioned in the housing out of the housing when the housing is ruptured.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: March 31, 2020
    Assignee: SPIN MASTER LTD.
    Inventors: Amy A. Pruzansky, David L. McDonald, Tat Wah Wong
  • Patent number: 8347502
    Abstract: The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: January 8, 2013
    Assignee: GE Intelligent Platforms, Inc.
    Inventors: David S. Slaton, David L. McDonald
  • Patent number: 8300424
    Abstract: A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: October 30, 2012
    Assignee: GE Intelligent Platforms Embedded Systems, Inc.
    Inventors: Jerry Wright, David L. McDonald
  • Publication number: 20120039053
    Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
    Type: Application
    Filed: October 28, 2011
    Publication date: February 16, 2012
    Inventors: David S. Slaton, David L. McDonald, Shreenath S. Perlaguri
  • Patent number: 8091224
    Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: January 10, 2012
    Assignee: GE Intelligent Platforms Embedded Systems, Inc.
    Inventors: David S. Slaton, David L. McDonald, Shreenath S. Perlaguri
  • Publication number: 20100128424
    Abstract: A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.
    Type: Application
    Filed: November 25, 2008
    Publication date: May 27, 2010
    Inventors: Jerry WRIGHT, David L. McDONALD
  • Publication number: 20100083497
    Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
    Type: Application
    Filed: October 6, 2008
    Publication date: April 8, 2010
    Inventors: David S. SLATON, David L. McDonald, Shreenath S. Perlaguri
  • Publication number: 20090169410
    Abstract: The present disclosure is related to creating blocks of aluminum and/or copper material having embedded TPG elements for forming heatsinks. The metal blocks have an improved thermal conductivity in the X-Y plane. Furthermore, the TPG-embedded heatsinks can be created using methods capable of being performed using various machines and equipment in many various facilities.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Inventors: David S. Slaton, David L. McDonald
  • Publication number: 20090166021
    Abstract: The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
    Type: Application
    Filed: December 28, 2007
    Publication date: July 2, 2009
    Inventors: David S. Slaton, David L. McDonald
  • Publication number: 20090165302
    Abstract: The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Inventors: David S. SLATON, David L. McDonald
  • Patent number: D798960
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: October 3, 2017
    Assignee: Spin Master Ltd.
    Inventors: Tat Wah Wong, David L. McDonald, Mina Mirkazemi, Walter Ma