Abstract: Described herein are methods of treating a tissue using a treatment tip apparatus (e.g., devices, systems, etc.) including one, or more preferably a plurality, of electrodes that are protected by an electrode partition, such as an electrode housing (which may be retractable) until pressed against the tissue for deployment of the electrodes and delivery of a therapeutic treatment. In particular, these methods may include the use of a plurality of treatment electrodes (e.g., needle electrodes) and in some examples may include for the delivery of nanosecond pulsed electric fields.

Abstract: Treatment applicators and methods including treatment applicators for delivering electrical energy to a target tissue that are configured to reduce or eliminate arcing as well as provide enhance targeting to tissue surfaces or regions just below the surface of the tissue.

Abstract: A module modular containment system for isolating and cooling racks of information handling systems in a facility comprises a plurality of vertical panels coupled to a top panel to isolate the rack from room air and a heat exchanger coupled to a facility water feed that supplies water at a water temperature greater than the room air temperature. Heated air exiting the rack passes through the heat exchanger to transfer heat to the water such that the air is cooled to the first air temperature. An air conditioning system and the modular containment system can operate independently to cool the room air to a lower air temperature for the comfort of people in the facility and to cool information handling systems based on operating parameters of the information handling systems.

Abstract: Information handling system (IHS) component immersion cooling systems and methods may employ a cold plate disposed on one or more IHS components of an IHS disposed in an immersion cooling tank and an immersible immersion fluid pump adapted to be deployed in the immersion cooling tank, the immersible immersion fluid pump in fluid flow communication with the cold plate, directing flow of immersion fluid in the immersion cooling tank to the cold plate. The immersible immersion fluid pump may be disposed on the cold plate or in an equipment bay of the IHS. A manifold may distribute flow from first and/or second immersible immersion fluid pump(s) to first and second cold plates. Power, etc. may be provided to the immersible immersion fluid pump via (a) fan connection(s) provided by the IHS. Tubing may extend from an outlet of the cold plate away from other components of the IHS.

Abstract: A portable or modular cooling system is operated via the power-over-Ethernet (PoE) standard. The cooling system receives electrical power via an Ethernet connection to a source device (such as a server, switch, or other PoE-enabled equipment). The cooling system may thus be used to spot-inject cooler ambient air in the vicinity of the source device without the need for grid electric and for cumbersome electrical wiring.

Abstract: A rack system is disclosed. The racks and the computer systems included within the racks have a shallow configuration. The racks are placed next to one another in a back-to-back configuration in which the backs of each of the racks are adjacent to one another. All of the user-accessible components of the computers system face toward the front of each rack. The heated air from each of the computer systems is expelled in the space between each of the racks. The space between each of the racks is relatively narrow, as there are no user-accessible components between the racks. The racks are coupled to one another with a bar that may include at least some spring action to accommodate some movement of the racks toward or away from one another without the tipping of either rack.

Abstract: Embodiments of the invention are directed to methods and systems for backflow prevention for computing devices. In an embodiment, a system of sensors, processors, and airflow stimulation devices, such as fans, are used to prevent backflow of high temperature gasses through a server housing. The backflow of high temperature gasses may be a result of a pressure differential between a region in which cooling gases are disposed and a region in which high temperature exhaust gasses are disposed.

Abstract: An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.

Abstract: An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.

Abstract: A portable or modular cooling system is operated via the power-over-Ethernet (PoE) standard. The cooling system receives electrical power via an Ethernet connection to a source device (such as a server, switch, or other PoE-enabled equipment). The cooling system may thus be used to spot-inject cooler ambient air in the vicinity of the source device without the need for grid electric and for cumbersome electrical wiring.

Abstract: Systems and methods for a dry power supply for immersion-cooled Information Handling Systems (IHSs) are described. In some embodiments, an IHS may include: a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant, where the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS; and a power supply coupled to the chassis and configured to provide power to the one or more components via an adaptor configured to maintain the power supply above the surface of the dielectric liquid coolant during operation of the IHS, where the power supply comprises a fan configured to blow air.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.

Abstract: Systems and methods for a dry power supply for immersion-cooled Information Handling Systems (IHSs) are described. In some embodiments, an IHS may include: a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant, where the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS; and a power supply coupled to the chassis and configured to provide power to the one or more components via an adaptor configured to maintain the power supply above the surface of the dielectric liquid coolant during operation of the IHS, where the power supply comprises a fan configured to blow air.

Abstract: A rack system is disclosed. The racks and the computer systems included within the racks have a shallow configuration. The racks are placed next to one another in a back-to-back configuration in which the backs of each of the racks are adjacent to one another. All of the user-accessible components of the computers system face toward the front of each rack. The heated air from each of the computer systems is expelled in the space between each of the racks. The space between each of the racks is relatively narrow, as there are no user-accessible components between the racks. The racks are coupled to one another with a bar that may include at least some spring action to accommodate some movement of the racks toward or away from one another without the tipping of either rack.

Abstract: A rack system is disclosed. The racks and the computer systems included within the racks have a shallow configuration. The racks are placed next to one another in a back-to-back configuration in which the backs of each of the racks are adjacent to one another. All of the user-accessible components of the computers system face toward the front of each rack. The heated air from each of the computer systems is expelled in the space between each of the racks. The space between each of the racks is relatively narrow, as there are no user-accessible components between the racks. The racks are coupled to one another with a bar that may include at least some spring action to accommodate some movement of the racks toward or away from one another without the tipping of either rack.

Abstract: Embodiments of the invention are directed to methods and systems for backflow prevention for computing devices. In an embodiment, a system of sensors, processors, and airflow stimulation devices, such as fans, are used to prevent backflow of high temperature gasses through a server housing. The backflow of high temperature gasses may be a result of a pressure differential between a region in which cooling gases are disposed and a region in which high temperature exhaust gasses are disposed.

Abstract: A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of the enclosures and the computer system contained therein. Heated air is removed from each computer system through the vent in the partition that is associated with the computer system. Multiple chassis may be placed one atop another in a vertical configuration in which each chassis is either directly above or directly below another chassis. In this vertical configuration, the vents form a vertically oriented common plenum that can be used to evacuate air from multiple chassis arranged in a rack.

Abstract: A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.