Patents by Inventor David L. Reed
David L. Reed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942595Abstract: Rechargeable batteries include a NiyFe1-y cathode where 0?y?1, an anode comprising a current collector, a porous separator positioned between the cathode and the anode, and an electrolyte comprising MAlX4, wherein M is Na, Li, K, or a combination thereof, and X is Cl, Br, I, or a combination thereof, and wherein the electrolyte is a solid at temperatures less than 50° C. The batteries are temperature activated. The electrolyte temperature is increased above its melting point while charging and reduced below the melting point for energy storage, such as seasonal energy storage. The electrolyte temperature is increased above the melting point again to discharge the battery.Type: GrantFiled: May 25, 2021Date of Patent: March 26, 2024Assignee: Battelle Memorial InstituteInventors: Guosheng Li, Vincent L. Sprenkle, Minyuan M. Li, David M. Reed, Evgueni Polikarpov
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Patent number: 8372157Abstract: An osteoconductive backing implant for joint revisions is provided that may enhance bone healing and, for cementless implants, bony integration of the implant. The backing implant comprises a generally planar surface that may be formed into a generally hemispherical shape. In one embodiment, the backing implant comprises a disc having an inner hole and an outer edge, at least one slit extending from the inner hole to the outer edge. The disc may be formed from a coherent mass of elongate, mechanically entangled demineralized bone particles.Type: GrantFiled: February 11, 2008Date of Patent: February 12, 2013Assignee: Warsaw Orthopedic, Inc.Inventors: Kenneth C. Petersen, Thomas Einhorn, David L. Reed
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Patent number: 7808706Abstract: Microlens arrays include a substrate, an array of microlenses on a first side of the substrate and an aperture mask on a second side of the substrate. The aperture mask includes an array of apertures at optical axes of the lenses. A second array of apertures may be included in the aperture mask at randomized positions therein. The randomized apertures may be provided in the aperture mask by providing a diffusive layer between the aperture mask and the substrate, and directing coherent radiation through the lens array, the diffusive layer and aperture mask.Type: GrantFiled: February 9, 2005Date of Patent: October 5, 2010Assignee: Tredegar Newco, Inc.Inventors: Edward Fadel, Robert P. Freese, Richard N. Gardner, Michele E. Nuzum, David L. Reed, Thomas A. Rinehart, Robert L. Wood
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Publication number: 20100049326Abstract: An osteoconductive backing implant for joint revisions is provided that may enhance bone healing and, for cementless implants, bony integration of the implant. The backing implant comprises a generally planar surface that may be formed into a generally hemispherical shape. In one embodiment, the backing implant comprises a disc having an inner hole and an outer edge, at least one slit extending from the inner hole to the outer edge. The disc may be formed from a coherent mass of elongate, mechanically entangled demineralized bone particles.Type: ApplicationFiled: February 11, 2008Publication date: February 25, 2010Inventors: Kenneth C. Petersen, Thomas Einhorn, David L. Reed
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Patent number: 7646538Abstract: Methods for creating apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof include curving the substrate into a cylindrical surface segment that defines an axis, so that the microlens array on the front side of the substrate faces the axis. A pulsed laser beam is scanned from the axis circumferentially along the cylindrical surface segment, to pass through the microlens array on the front side of the substrate and into the layer on the back side of the substrate to create the apertures, while simultaneously translating the substrate and/or the scanned pulsed laser beam axially relative to one another. Related apparatus and microlens array products are also disclosed.Type: GrantFiled: May 13, 2008Date of Patent: January 12, 2010Assignee: Bright View Technologies, Inc.Inventors: Richard N. Gardner, John W. Wilson, Brian C. Cox, Reese A. Jernigan, David L. Reed
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Publication number: 20080252983Abstract: Methods for creating apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof include curving the substrate into a cylindrical surface segment that defines an axis, so that the microlens array on the front side of the substrate faces the axis. A pulsed laser beam is scanned from the axis circumferentially along the cylindrical surface segment, to pass through the microlens array on the front side of the substrate and into the layer on the back side of the substrate to create the apertures, while simultaneously translating the substrate and/or the scanned pulsed laser beam axially relative to one another. Related apparatus and microlens array products are also disclosed.Type: ApplicationFiled: May 13, 2008Publication date: October 16, 2008Inventors: Richard N. Gardner, John W. Wilson, Brian C. Cox, Reese A. Jernigan, David L. Reed
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Patent number: 7420742Abstract: Electromagnetic Interference (EMI) shields for a direct-view display having a direct-view display panel and an outer panel that provides an outer surface for the direct-view display. These EMI shields include a conductive mesh having an array of gaps therein. The conductive mesh is configured to shield at least some of the EMI that is emitted by the direct-view display panel. An optical redirecting structure is also included, that is configured to redirect at least some optical radiation that is emitted from the direct-view display panel that would strike the conductive mesh, through the gaps in the conductive mesh. The EMI shield is configured to mount between the direct-view display panel and the outer panel such that the optical redirecting structure is adjacent the direct-view display panel and the conductive mesh is remote from the direct-view display panel.Type: GrantFiled: March 17, 2006Date of Patent: September 2, 2008Assignee: Bright View Technologies, Inc.Inventors: Robert L. Wood, David L. Reed
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Publication number: 20080084611Abstract: Methods for creating apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof include curving the substrate into a cylindrical surface segment that defines an axis, so that the microlens array on the front side of the substrate faces the axis. A pulsed laser beam is scanned from the axis circumferentially along the cylindrical surface segment, to pass through the microlens array on the front side of the substrate and into the layer on the back side of the substrate to create the apertures, while simultaneously translating the substrate and/or the scanned pulsed laser beam axially relative to one another. Related apparatus and microlens array products are also disclosed.Type: ApplicationFiled: October 5, 2006Publication date: April 10, 2008Inventors: Richard N. Gardner, John W. Wilson, Brian C. Cox, Reese A. Jernigan, David L. Reed
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Patent number: 7154379Abstract: An evacuation system using a combination of elements, such as an on-site weather station (2), a computer system (1) with proprietary software, sensors and other elements to determine a safe direction of evacuation from a premises (11) in case of a threat, use indicators to determine the direction of evacuation and notification of parties external to the premises (11) of evacuation.Type: GrantFiled: March 15, 2004Date of Patent: December 26, 2006Inventor: David L. Reed
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Publication number: 20040201470Abstract: An evacuation system using a combination of elements, such as an on-site weather station (2), a computer system (1) with proprietary software, sensors and other elements to determine a safe direction of evacuation from a premises (11) in case of a threat, use indicators to determine the direction of evacuation and notification of parties external to the premises (11) of evacuation.Type: ApplicationFiled: March 15, 2004Publication date: October 14, 2004Inventor: David L. Reed
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Patent number: 6663436Abstract: In accordance with the invention, there is provided a telecommunication jack that is free of cross-over sections, has cross-talk characteristics that approach Category 6 levels, and avoids the use of spring contact wires supported in a cantilevered fashion. This is achieved in a preferred implementation by spring terminal contact wires that are arch shaped. Each spring wire has a first leg having an end, a second leg having an end and an apex portion located between the first and second legs where the ends of the legs are supported on a wire board and each end makes electrical contact with separate conductive pads. When utilized in an operating circuit, one end and leg of a spring terminal contact wire is coupled to a conductive pad on the wire board that is in a current carrying signal path, and the other end and leg of that spring terminal contact wire is coupled to a different conductive pad on the wire board adapted for connection to a cross-talk compensating component.Type: GrantFiled: July 17, 2002Date of Patent: December 16, 2003Assignee: Avaya Technology Corp.Inventors: Jamie R. Arnett, Robert R. Goodrich, David L. Reed, Paul J. Straub
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Publication number: 20020142667Abstract: A multi-contact connector jack is interchangeable with mating plugs having an equal number of contacts for forming a high performance connector and with plugs having a lesser number of contacts without damage to the jack. The jack has a plurality of rear cantilevered spring wires arranged in a linear array for mating with contact blades in the plug, wherein at least the two end positioned spring wires have a plug contact region followed by a depressed region wherein the plug nose of a plug of fewer contacts ceases to depress the spring wires to an extreme degree, thereby preserving the resilience of the spring wires.Type: ApplicationFiled: March 29, 2001Publication date: October 3, 2002Inventors: David L. Reed, Paul J. Straub
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Publication number: 20020137385Abstract: A connection system for communication connectors. A first connector housing forms a front opening having an axis for receiving a second connector having a latch in the direction of the axis. The first connector housing has a retaining surface in the region of the front opening for cooperating with a part of the latch and defining a connected position for the second connector within the first connector housing. At least two resilient fingers project from a rear portion of the first connector housing toward the front opening, symmetrically with respect to the axis of the opening. Free ends of the fingers urge the second connector toward the connected position and restrain the second connector from deviating from the connected position during use. Optimal electrical performance of the mated connectors can then be maintained.Type: ApplicationFiled: July 30, 2001Publication date: September 26, 2002Inventors: Robert Ray Goodrich, David L. Reed, Ted E. Steele, Paul J. Straub
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Patent number: 6454590Abstract: A connection system for communication connectors. A first connector housing forms a front opening having an axis for receiving a second connector having a latch in the direction of the axis. The first connector housing has a retaining surface in the region of the front opening for cooperating with a part of the latch and defining a connected position for the second connector within the first connector housing. At least two resilient fingers project from a rear portion of the first connector housing toward the front opening, symmetrically with respect to the axis of the opening. Free ends of the fingers urge the second connector toward the connected position and restrain the second connector from deviating from the connected position during use. Optimal electrical performance of the mated connectors can then be maintained.Type: GrantFiled: July 30, 2001Date of Patent: September 24, 2002Assignee: Avaya Technology Corp.Inventors: Robert Ray Goodrich, David L. Reed, Ted E. Steele, Paul J. Straub, Jr.
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Patent number: 6443777Abstract: A communication jack has a first pair and a second pair of contact wires defining corresponding signal paths in the jack. Parallel, co-planar free end portions of the wires are formed to connect electrically with a mating connector that introduces offending crosstalk to the signal paths. First free end portions of the first pair of contact wires are supported adjacent one another, and second free portions of the second pair are supported adjacent corresponding ones of the first free end portions. Intermediate sections of the first pair of contact wires diverge vertically and traverse one another to align adjacent to corresponding intermediate sections of the second pair of wires, to produce sufficient inductive compensation coupling to counter the offending crosstalk from the plug. Capacitive compensation coupling may be obtained for the contact wires via one or more printed wiring boards supported on or in the jack housing.Type: GrantFiled: June 22, 2001Date of Patent: September 3, 2002Assignee: Avaya Technology Corp.Inventors: Alan H. McCurdy, Julian R. Pharney, David L. Reed, Ted E. Steele, Paul J. Straub
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Patent number: 5820038Abstract: An apparatus for dispensing a photoresist solution onto a semiconductor wafer. The apparatus may include a base that attaches a dispense arm to a track. A receiver may be connected to a distal end of the arm and a nozzle may extend through an aperture in the receiver. The arm may move along the track while dispensing photoresist solution through the nozzle onto a wafer. The arm may include a pivotal connector to allow a distal end of the arm to be raised to facilitate cleaning of the apparatus.Type: GrantFiled: October 28, 1996Date of Patent: October 13, 1998Assignee: Advanced Micro Devices, Inc.Inventors: Paul Beltran, David L. Reed
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Patent number: 5186649Abstract: A modular plug (23) for terminating cordage includes a housing (41) having a free end (46) and a cordage-input end. An end portion of a length of cordage (21) to be terminated by the plug is inserted into the cordage-input end of the housing to cause exposed individually insulated conductors extending beyond a jacketed portion of the cordage to be received in a conductor-holding portion of the housing. Blade-like terminals (42--42) inserted into slots opening to an exterior surface of the housing engage electrically the conductors. An anchoring member (61) is caused to be moved to an operative position whereat a primary jacket anchoring surface (74) of the anchoring member becomes disposed in compressive engagement with a jacket of the cordage. The geometry of the anchoring member is such that the primary anchoring surface in an unoperated position is angled to a longitudinal axis of the end portion of the length of cordage.Type: GrantFiled: April 30, 1992Date of Patent: February 16, 1993Assignee: AT&T Bell LaboratoriesInventors: Larry E. Fortner, Paul R. Gustin, Leonard F. Hasler, Harold E. Johnson, George R. Maul, David L. Reed, George W. Reichard, Jr.