Abstract: A laser system emits a laser beam at a surface of a substrate to modify the surface. The substrate is cleaned to increase reflectivity of the surface. The laser beam is applied to the surface. The laser beam moves across the surface of the substrate. The surface is modified by the laser beam to vary the surface up to one micron, or 1 ?m. A surface area of the surface is increased by the variations. The laser beam is stopped after modification of the surface of the substrate is complete.

Abstract: A system for filtering a precipitate from a chemical solvent is disclosed herein. The system includes a first pipe segment configured to transport a chemical solvent having a composition dissolved therein, a first ultraviolet light disposed adjacent the first pipe segment and configured to irradiate the chemical solvent and the composition inside the first pipe segment, wherein the composition precipitates from the chemical solvent forming a plurality of particles in response to the first ultraviolet light, a first filter having a first inlet and a first outlet and configured to remove a first portion of the plurality of particles from the chemical solvent, wherein the first inlet is coupled to the first pipe segment, and a second pipe segment coupled to the first outlet and configured to transport the chemical solvent.

Abstract: A rotating plating fixture changes an orientation of the substrate throughout a plating cycle. The plating fixture changes the orientation by precisely controlling a rotation speed and position of the substrate. A stepper motor changes the orientation in response to control signals from a controller. The plating fixture includes a stepper motor fixed to a hanger, a shaft coupled to the stepper motor, a pinion gear coupled to the shaft such that rotation of the shaft by the stepper motor causes rotation of the pinion gear, and a bevel gear meshing with the pinion gear.

Abstract: A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.

Abstract: A vertically integrated circuit assembly may include a substrate including a plurality of electrical traces, and a first circuit assembly layer disposed on the substrate. In embodiments, the first circuit assembly layer includes a first set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the first circuit assembly layer. In embodiments, the vertically integrated circuit assembly further includes a second circuit assembly layer coupled to the top surface of the first circuit assembly layer. The second circuit assembly layer may include a second set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the second circuit assembly layer. In embodiments, an electrical interconnect arrangement on a top surface of the first circuit assembly layer is configured to interface with an electrical interconnect arrangement on the bottom surface of the second circuit assembly layer.

Abstract: A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.