Patents by Inventor David L. Wynants

David L. Wynants has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low signal loss bonding ply for multilayer circuit boards
    Patent number: 6861092
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: March 1, 2005
    Assignee: Tonoga, Inc.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Low signal loss bonding ply for multilayer circuit boards
    Patent number: 6783841
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: August 31, 2004
    Assignee: Tonoga, Inc.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Low signal loss bonding ply for multilayer circuit boards
    Publication number: 20030203174
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Application
    Filed: May 29, 2003
    Publication date: October 30, 2003
    Applicant: TONOGA, INC.
    Inventors: Thomas F. McCarthy, David L. Wynants
  • Low signal loss bonding ply for multilayer circuit boards
    Publication number: 20030072929
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Application
    Filed: November 7, 2002
    Publication date: April 17, 2003
    Applicant: TONOGA, LTD
    Inventors: Thomas F. McCarthy, David L. Wynants
  • Low signal loss bonding ply for multilayer circuit boards
    Patent number: 6500529
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: December 31, 2002
    Assignee: Tonoga, Ltd.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.