Abstract: The present invention relates to a heat exchanger device for cooling one or more electrical or electronic devices, wherein the electrical or electronic device generates heat that must be drained through an outer exchange surface. Improvement in heat transfer requires close contact between the surface of the device to be cooled and of the heat exchanger responsible for removing heat, and this close contact requires the application of large mechanical stresses. The exchanger is configured such that it improves robust response without reducing the exchange capacity with the electrical or electronic device. The present invention presents the advantages of energy efficiency and therefore has a relevant impact on the environment.

Abstract: The present description relates to a flat heat exchanger of the types which use a single working fluid circulating continuously through the inside of one or a plurality of heat transmission conduits for cooling one or more electric or electronic components or the like located in a position close to or in contact with a region of the outer part of at least one heat transmission conduit.