Abstract: Microelectromechanical RF and microwave frequency power limiter and electrostatic protection devices for use in high-speed circuits are presented. The devices utilize an airbridge or a cantilever arm including a contact pad positioned operatively adjacent to an electrically conductive and substantially planar transmission line. When the power level in the transmission line exceeds a particular threshold, the airbridge or cantilever arm yields due to force between the contact pad and the transmission line, directing undesired power away from active devices. This characteristic can either serve as a method by which to limit the amount of power passing through the transmission line to a determined value or as a method by which to protect devices along the transmission line from damage due to large electrostatic bursts.

Abstract: Microelectromechanical RF and microwave frequency power limiter and electrostatic protection devices for use in high-speed circuits are presented. The devices utilize an airbridge or a cantilever arm including a contact pad positioned operatively adjacent to an electrically conductive and substantially planar transmission line. When the power level in the transmission line exceeds a particular threshold, the airbridge or cantilever arm yields due to force between the contact pad and the transmission line, directing undesired power away from active devices. This characteristic can either serve as a method by which to limit the amount of power passing through the transmission line to a determined value or as a method by which to protect devices along the transmission line from damage due to large electrostatic bursts.

Abstract: The present invention provides a flexible mechanical bridge over a microstrip on a substrate, which utilizes an electromagnetic field increase, as generated by temporary power surge to shunt harmful power away from a MMIC system. The invention includes a power limiter which includes an airbridge 11, preferably in the form of an electrically conductive strip with ground contacts 1 and 3 formed thereon. The ground contacts 1 and 2 are electrically connected, through via holes 5 and 7 respectively, to a metallization layer 15 formed on the bottom side of a substrate 9. The air bridge 11 is designed such that it traverses an electrically conductive microstrip 13 forming an air gap 16 between the air bridge 11 and the electrically conductive microstrip 13. When there is a power surge the air bridge 11, will flex to cause an electrical connection with the microstrip 13, thereby directing the unwanted signal through the ground contacts 1 and 3 and the via holes 5 and 7 to the metallization layer 15.