Abstract: The present disclosure relates to a data storage device interior components and/or data storage device housing components that include one or more solid-state deposition layers, and related methods of applying solid-state material to said components via solid-state deposition.

Abstract: The present disclosure relates to a data storage device interior components and/or data storage device housing components that include one or more solid-state deposition layers, and related methods of applying solid-state material to said components via solid-state deposition.

Abstract: The present disclosure relates to a data storage device interior components and/or data storage device housing components that include one or more solid-state deposition layers, and related methods of applying solid-state material to said components via solid-state deposition.

Abstract: The present disclosure relates to a data storage device interior components and/or data storage device housing components that include one or more solid-state deposition layers, and related methods of applying solid-state material to said components via solid-state deposition.

Abstract: The present disclosure relates to a data storage device interior components and/or data storage device housing components that include one or more solid-state deposition layers, and related methods of applying solid-state material to said components via solid-state deposition.

Abstract: The present disclosure relates to using solid state deposition to selectively and strategically manage one or more properties of one or more portions of a data storage device. Material deposited via solid-state deposition can be used to prepare a surface for subsequent treatment (e.g., welding), to join two or more substrates together, and/or to seal one or more joints or surfaces to control, e.g., the humidity in the interior of a data storage device. The present disclosure also involves related data storage devices.

Abstract: The present disclosure relates to using solid state deposition to selectively and strategically manage one or more properties of one or more portions of a data storage device. Material deposited via solid-state deposition can be used to prepare a surface for subsequent treatment (e.g., welding), to join two or more substrates together, and/or to seal one or more joints or surfaces to control, e.g., the humidity in the interior of a data storage device. The present disclosure also involves related data storage devices.

Abstract: Methods and systems for determining which groups of instructions are to be executed when a specific symbol patterns has been detected. A prefetch block receives an identification of the symbol pattern detected. The prefetch block then retrieves the groups of instructions which relate to that particular symbol pattern. These are passed to an execution block that retrieves state information for each user defined rule from which the groups of instructions originate. The execution block then checks, for each group of instructions, the state information. If the state information indicates that a particular group of instructions can be executed, the execution block executes that group.

Abstract: A method for attaching a printed circuit card assembly to an actuator assembly in a disc drive comprises forming one or more pins integrally with the actuator assembly, inserting each pin through a corresponding pin opening in the printed circuit card assembly, and attaching the pins to the printed circuit card assembly. The pins may be attached to the printed circuit card assembly by a soldering process, or alternatively, pressure may be applied to a top surface of the pins to cause them to deform over the printed circuit card assembly, thereby securing the printed circuit card assembly to the actuator assembly. A disc drive in accordance with a preferred embodiment of this invention has an actuator assembly with one or more integral pins and a printed circuit card assembly attached to the integral pins.