Abstract: A laminated window assembly has a first glass pane with a coating formed thereon, a second glass pane, and a polymeric interlayer provided between the first glass pane and the second glass pane. The coating includes a first layer deposited over a major surface of the glass pane, wherein the first layer has a refractive index of 1.6 or more and a thickness of 50 nm or less, a second layer deposited over the first layer, wherein the second layer has a refractive index that is less than the refractive index of the first layer and a thickness of 50 nm or less, a third layer deposited over the second layer, wherein the third layer has a refractive index that is greater than the refractive index of the second layer and a thickness of less than 500 nm, and a fourth layer deposited over the third layer, wherein the fourth layer has a refractive index that is less than the refractive index of the third layer and a thickness of 100 nm or less.

Abstract: A laminated window assembly has a first glass pane with a coating formed thereon, a second glass pane, and a polymeric interlayer provided between the first glass pane and the second glass pane. The coating includes a first layer deposited over a major surface of the glass pane, wherein the first layer has a refractive index of 1.6 or more and a thickness of 50 nm or less, a second layer deposited over the first layer, wherein the second layer has a refractive index that is less than the refractive index of the first layer and a thickness of 50 nm or less, a third layer deposited over the second layer, wherein the third layer has a refractive index that is greater than the refractive index of the second layer and a thickness of less than 500 nm, and a fourth layer deposited over the third layer, wherein the fourth layer has a refractive index that is less than the refractive index of the third layer and a thickness of 100 nm or less.

Abstract: A process for the production of an optoelectronic device, such as a photovoltaic cell or a light emitting diode is disclosed. The process comprises providing a substrate having a conductive coating on at least one surface, the conductive coating having an initial roughness and at least one or more spikes, and applying a functional component to the coated surface of the substrate. The surface of the substrate having the conductive coating has been subjected to a polishing step using at least one brush to reduce the height of the spikes inherent to the conductive coating and to give the conductive coating a final roughness. By reducing the spikes there is less potential for the optoelectronic device to suffer from electrical shunts which reduce the efficiency of the device.

Abstract: A process for the production of an optoelectronic device, such as a photovoltaic cell or a light emitting diode is disclosed. The process comprises providing a substrate having a conductive coating on at least one surface, the conductive coating having an initial roughness and at least one or more spikes, and applying a functional component to the coated surface of the substrate. The surface of the substrate having the conductive coating has been subjected to a polishing step using at least one brush to reduce the height of the spikes inherent to the conductive coating and to give the conductive coating a final roughness. By reducing the spikes there is less potential for the optoelectronic device to suffer from electrical shunts which reduce the efficiency of the device.