Patents by Inventor David Lee Crouthamel

David Lee Crouthamel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic packages
    Patent number: 7671436
    Abstract: Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: March 2, 2010
    Assignee: Agere Systems Inc.
    Inventors: Ahmed Nur Amin, Mark Adam Bachman, David Lee Crouthamel, John William Osenbach, Brian Thomas Vaccaro
  • Electronic packages
    Publication number: 20090273078
    Abstract: Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
    Type: Application
    Filed: May 2, 2008
    Publication date: November 5, 2009
    Inventors: Ahmed Nur Amin, Mark Adam Bachman, David Lee Crouthamel, John William Osenbach, Brian Thomas Vaccaro