Patents by Inventor David Lee Questad

David Lee Questad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package
    Patent number: 6226187
    Abstract: The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: May 1, 2001
    Assignee: International Business Machines Corporation
    Inventors: David Lee Questad, Anne Marie Quinn, George Henry Thiel, Donna Jean Trevitt, Tien Yue Wu, Patrick Robert Zippetelli
  • Integrated circuit package including a heat sink and an adhesive
    Patent number: 6084299
    Abstract: The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.
    Type: Grant
    Filed: November 9, 1995
    Date of Patent: July 4, 2000
    Assignee: International Business Machines Corporation
    Inventors: David Lee Questad, Anne Marie Quinn, George Henry Thiel, Donna Jean Trevitt, Tien Yue Wu, Patrick Robert Zippetelli
  • Chip carrier and cable assembly reinforced at edges
    Patent number: 5872337
    Abstract: Reinforcement members are disposed along only the transverse edge regions of selected flexible cables of an integral chip carrier and cable assembly, and along only the respectively aligned end areas of the chip carrier portion of the assembly. The reinforcement members may be disposed along all of the flexible cables and end areas of the assembly, or on only selected cable and end area portions of the assembly. The reinforcement members are formed of a tough tear resistant polymer material, such as a hot melt adhesive or polymer tape or film.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: February 16, 1999
    Assignee: International Business Machines Corporation
    Inventors: Donald Seton Farquhar, Stephen Joseph Fuerniss, Charles Robert Davis, David Lee Questad, Darbha Suryanarayana, Jeffrey Alan Zimmerman