Patents by Inventor David Lee Rath

David Lee Rath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device cleaning employing heterogeneous nucleation for controlled cavitation
    Patent number: 7270130
    Abstract: The present invention provides a method for cleaning semiconductor devices through heterogeneous nucleation of cavitation bubbles. Heterogeneous nucleation is performed by applying sonic energy to a cleaning solution and a phase material in order to remove unwanted particles from semiconductor devices. A surfactant may be added to the phase material and the cleaning solution.
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: September 18, 2007
    Assignees: Infineon Technologies AG, International Business Machines Corporation
    Inventors: Ravikumar Ramachandran, David Lee Rath
  • Etching composition and use thereof
    Patent number: 6630074
    Abstract: An aqueous etchant composition containing about 0.01 to about 15 percent by weight of sulfuric acid and about 0.01 to about 20 percent by weight of hydrogen peroxide or about 1 to 30 ppm of ozone, and about 0.01 to 100 ppm of hydrofluoric acid is effective in removing polymer and via residue from a substrate or conductive material, and especially from an integrated circuit chip having aluminum lines thereon.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: October 7, 2003
    Assignee: International Business Machines Corporation
    Inventors: David Lee Rath, Ravikumar Ramachandran
  • Etching composition and use thereof
    Patent number: 5780363
    Abstract: An aqueous etchant composition containing about 0.01 to about 15 percent by weight of sulfuric acid and about 0.01 to about 20 percent by weight of hydrogen peroxide or about 1 to 30 ppm of ozone is effective in removing polymer residue from a substrate, and especially from an integrated circuit chip having aluminum lines thereon.
    Type: Grant
    Filed: April 4, 1997
    Date of Patent: July 14, 1998
    Assignee: International Business Machines Coporation
    Inventors: Donald John Delehanty, Rangarajan Jagannathan, Kenneth John McCullough, Donna Diane Miura, George F. Ouimet, Jr., David Lee Rath, Bryan Newton Rhoads, Frank John Schmidt, Jr.