Abstract: A power supply and a method of manufacture therefor. The power supply includes a circuit board containing conductors for interconnecting electrical components of the power supply and a thermally-conductive case having an integral electrically insulating layer. The thermally-conductive case forms a reservoir to receive the circuit board therein. The power supply further includes a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board. The power supply still further includes an encapsulant, located within the reservoir, capable of ensconcing the power semiconductor device and the electrical components. Additionally, electrical leads extend from the power supply that allows the power supply to be coupled to a printed wiring board.

Abstract: An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation.

Abstract: A package for an electrical apparatus is disclosed. The electrical apparatus includes a plurality of electrical components; the package comprises: (a) a first circuit board having a top side and a bottom side, and having a first array of the plurality of components arranged on at least one side of the top side and the bottom side; (b) a second circuit board in electrical and mechanical connection with the first circuit board; the second circuit board has a first side and a second side. The first side faces the top side of the first circuit board. The second circuit board has a second array of the plurality of components arranged on the first side. The second circuit board preferably has at least one heat dissipating structure substantially integrally affixed on the second side. Preferably, the second side is a metal substrate and the first side is electrically insulated from the second side.

Abstract: A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally conductive baseplate or case operable for transferring heat generated inside the module to the outside environment, wherein the external package dimensions are of a sufficiently small size to allow the user the greatest flexibility in the design of the overall circuit assembly, (3) at least one power magnetic device operable for providing electrical isolation between the input and the output of the power module, and (4) a set of electrical leads to facilitate communication and power flow between the module and circuitry being powered.