Abstract: Described is a thermally stabilized sensor for cooled component packages. A cooled component package includes a cooled component, a temperature-sensing device located adjacent to the cooled component, and a heat flow modifier located adjacent to the temperature-sensing device. Examples of the heat flow modifier include a ground shield, a wire bonded to platform upon which the cooled component is mounted, and a bonding layer between a refrigerator element and an optical subassembly that includes the cooled component.

Abstract: The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally, the thermal interposer comprises thin conductors in various configurations that convey electrical signals but significantly limit heat flow.

Abstract: A method of connecting a heatspreader to an integrated circuit device that is connected to a substrate in a flip-chip configuration includes forming a heatspreader from a single flat sheet of metal. The heatspreader has a heatspreader plate and a plurality of legs. The legs are flat plate portions substantially parallel to the heatspreader plate. A first thermal interface material is used to connect the heatspreader plate to a non-active side of the integrated circuit device. A second thermal interface material is used to connect each of the plurality of legs to the substrate.

Abstract: A circuit board assembly includes an integrated circuit package. A first substrate has first and second surfaces. Each surface of the first substrate has a plurality of terminal pads. An integrated circuit device has first and second faces. The first face has a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate. A heatspreader plate has a plurality of legs. For example, the heatspreader may be shaped like a table with four legs. The heatspreader may be formed of copper. The second face of the integrated circuit device is connected to the heatspreader plate by a first thermal interface material. Each of the plurality of legs is connected to the first surface of the first substrate by a second thermal interface material. The first and second thermal interface materials may both be, for example, a conductive silver-filled epoxy. The heatspreader provides an open package that is easily cleaned and drained.