Abstract: An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.

Abstract: An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.

Abstract: In some embodiments, a multi-processor system board has at least a first processor installed on the system board and at least a first liquid cooling system configured to provide dedicated cooling for the first processor. A second processor may be installed on the system board and a second liquid cooling system may be configured to provide dedicated cooling for the second processor. In some examples, a liquid cooling system includes a tank, a first heat exchanger attached to a first side of the tank, and a second heat exchanger attached to a second side of the tank opposite to the first side of the tank. Other embodiments are disclosed and claimed.

Abstract: Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.