Patents by Inventor David L. Lu

David L. Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and Apparatus for Improving the Reliability of Solder Joints
    Publication number: 20120002386
    Abstract: In accordance with an example embodiment of the present invention, a method, comprises receiving an integrated circuit component comprising at least one solder ball substantially surrounded by a first epoxy flux, applying a second epoxy flux to at least one integrated circuit component contact point of a printed circuit board, and performing a reflow process such that the integrated circuit component adheres to the printed circuit board and the first and second epoxy flux forms an encapsulating layer around at least one solder joint.
    Type: Application
    Filed: July 1, 2010
    Publication date: January 5, 2012
    Applicant: NOKIA CORPORATION
    Inventors: Lasse Juhani Pykari, David L. Lu