Abstract: A voltage regulator board may be mounted over a processor package on a motherboard. In some embodiments, this on top mounting may save space and may improve voltage power delivery. A voltage regulator interconnect may have a first upper level which contacts the voltage regulator board, in one embodiment, and a second lower contact which receives contacts on the lower side of the processor package. The processor package may then make contact through the voltage regulator interconnect directly to the motherboard. The contacts on the voltage regulator interconnect simply short power from the voltage regulator board through appropriate contacts on the processor package.

Abstract: An electronic component includes a semiconductor device (320) over a circuit board (210, 910), a heat sink (240, 940) over the semiconductor device, a clip (250, 950) over the heat sink and coupling the heat sink to anchors (230, 930) adjacent to the semiconductor device. A method of assembling the electronic component includes using an automated tool to couple the anchors to the circuit board, reflowing solder to electrically couple the semiconductor device and the anchors to a ground plane in the circuit board, and removably coupling the heat sink to the anchors.